IP Library › Granted Patent US 6,624,059
Granted Patent Utility
US 6,624,059 · Confirmation No. 9755

METHOD OF IMPROVING INTERCONNECT OF SEMICONDUCTOR DEVICES BY UTILIZING A FLATTENED BALL BOND

Inventor: Michael B. Ball
Patented Case View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2012-10-17 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2012-10-17 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2012-10-09 PA.. Power of Attorney 1 View
2012-10-09 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2012-10-09 N417 Electronic Filing System Acknowledgment Receipt 2 View
2003-07-03 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-07-03 LET. Miscellaneous Incoming Letter 2 View
2003-07-03 A.NE Response After Final Action 3 View
2003-07-03 SPEC Specification 5 View
2003-07-03 CLM Claims 3 View
2003-07-03 REM Applicant Arguments/Remarks Made in an Amendment 1 View
2003-07-03 DRW Drawings-only black and white line drawings 2 View
2002-07-15 TRNA Transmittal of New Application 2 View
2002-07-15 SPEC Specification 9 View
2002-07-15 CLM Claims 2 View
2002-07-15 ABST Abstract 1 View
2002-07-15 DRW Drawings-only black and white line drawings 4 View
2002-07-15 OATH Oath or Declaration filed 1 View
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Quick Facts
Patent No.
US 6,624,059
App. No.
10/197,271
Filed
2002-07-15
Granted
2003-09-23
Pub. No.
US20020177296A1
Art Unit
2812
PTA
-1 days