IP Library Assignment 008550/0082
Patent Assignment
Reel/Frame 008550/0082

Assignment of Assignor's Interest

Recorded: 1997-03-17 Pages: 3
Assignor
BORLAND, JOHN O.
Executed: 1997-03-14
Assignee
GENUS, INC.
1139 KARLSTAD DRIVE, SUNNYVALE, CALIFORNIA, 94089
Covered Property (1)
Method of Forming High Quality Bonded Soi Wafers Without Epitaxy Using High Energy Implanted Buried Layers
Application: 08/818,920 →
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Aug 29, 1997
From: GENUS, INC.
To: SUMITOMO BANK OF CALIFORNIA
Reel/Frame 008693/0866 →
Termination of Security Interest in Patents Jul 29, 1998
From: SUMITOMO BANK OF CALIFORNIA
To: GENUS, INC.
Reel/Frame 009386/0787 →
Assignment of Assignor's Interest Jul 30, 1998
From: GENUS, INC.
To: VARIAN ASSOCIATES, INC.
Reel/Frame 009350/0402 →
Assignment of Assignor's Interest Nov 30, 1998
From: GENUS, INC.
To: VARIAN ASSOCIATES, INC.
Reel/Frame 009605/0711 →
Assignment of Assignor's Interest Dec 15, 1998
From: GENUS, INC.
To: VARIAN ASSOCIATES, INC.
Reel/Frame 009866/0363 →