Patent Assignment
Reel/Frame 008693/0866
Security Agreement
Recorded: 1997-08-29
Pages: 43
Assignor
GENUS, INC.
Executed: 1997-08-15
Assignee
SUMITOMO BANK OF CALIFORNIA
SUITE 700, 84 WEST SANTA CLARA, SAN JOSE, CALIFORNIA, 95113
Covered Properties
(38)
Method and Apparatus for Deposition of Tungsten Silicides
Patent:
4,565,157 →
Application:
06/480,030 →
Cooled Optical Window for Semiconductor Wafer Heating
Patent:
4,550,684 →
Application:
06/522,638 →
Wafer Holding Apparatus for Ion Implantation
Patent:
4,553,069 →
Application:
06/568,175 →
Process for Depositing a Low Resistivity Tungsten Silicon Composite Film on a Substrate
Patent:
4,629,635 →
Application:
06/590,117 →
Non-Magnetic Sputtering Target
Patent:
4,597,847 →
Application:
06/658,738 →
Cooled Optical Window for Semiconductor Wafer Heating
Patent:
4,680,447 →
Application:
06/756,739 →
Charge Conversion Unit for Negative Ion Source
Patent:
4,712,012 →
Application:
06/759,464 →
Supplemental Electric Water Heater Unit for Cooling of a Hot Water Supply Line
Patent:
4,680,446 →
Application:
06/782,460 →
Interlayer Dielectric Process
Patent:
4,690,746 →
Application:
06/832,836 →
Semiconductor Substrate Heater and Reactor Process and Apparatus
Patent:
4,778,559 →
Application:
06/919,313 →
Ion Implantation with Variable Implant Angle
Patent:
4,745,287 →
Application:
06/922,319 →
Low Resistivity Tungsten Silicon Composite Film
Patent:
4,851,295 →
Application:
06/926,968 →
Threating Workpieces with Beams
Patent:
4,775,796 →
Application:
07/000,703 →
Dial Deposition and Processing Apparatus
Patent:
4,795,299 →
Application:
07/038,540 →
Semiconductor Substrate Treating Method
Patent:
4,956,046 →
Application:
07/251,108 →
Semiconductor Substrate Heater and Reactor Process and Apparatus
Patent:
4,891,335 →
Application:
07/251,115 →
Method and Apparatus for Deposition of Tungsten Silicides
Patent:
4,920,908 →
Application:
07/323,199 →
Perimeter Wafer Seal
Patent:
4,932,358 →
Application:
07/354,636 →
Precision Ultra-Sensitive Trace Detector for Carbon-14 When It Is at Concentrations Close to That Present in Recent Organic Materials
Patent:
4,973,841 →
Application:
07/474,376 →
Rutherford Backscattering Surface Analyzer with 180-Degree Deflecting and Focusing Permanent Magnet
Patent:
4,967,078 →
Application:
07/474,476 →
Differential Pressure Cvd Chuck
Patent:
5,094,885 →
Application:
07/596,512 →
Composite Sputtering Target Structures and Process for Producing Such Structures
Patent:
5,215,639 →
Application:
07/671,164 →
Ion Source
Patent:
5,162,699 →
Application:
07/776,598 →
Interchangeable Cvd Chuck Surface
Patent:
5,431,737 →
Application:
07/830,603 →
Differential Pressure Cvd Chuck
Patent:
5,383,971 →
Application:
07/849,488 →
Method of Selective Etching Native Oxide
Patent:
5,294,568 →
Application:
07/867,299 →
Purge Gas in Wafer Coating Area Selection
Patent:
5,447,570 →
Application:
07/902,995 →
Sacrificial Metal Etchback System
Patent:
5,330,607 →
Application:
07/938,303 →
Film Uniformity by Selective Pressure Gradient Control
Patent:
5,387,289 →
Application:
07/950,088 →
Method of Monitoring Ion Beam Current in Ion Implantation Apparatus for Use in Manufacturing Semiconductors
Patent:
5,319,212 →
Application:
07/958,077 →
Low-Temperature Low-Stress Blanket Tungsten Film
Patent:
5,272,112 →
Application:
07/973,841 →
Production of High Beam Currents at Low Energies for Use in Ion Implantation Systems
Patent:
5,306,922 →
Application:
08/033,286 →
Scan Technique to Reduce Transient Wafer Temperatures During Ion Implantation
Patent:
5,486,702 →
Application:
08/125,117 →
Method of Constructing Cmos Vertically Modulated Wells (Vmw) by Clustered Mev Billi (Buried Implanted Layer for Lateral Isolation) Implantation
Patent:
5,501,993 →
Application:
08/343,116 →
Semiconductor Device Having at Least One Field Oxide Area and Cmos Vertically Modulated Wells (Vmw) with a Buried Implanted Layer for Lateral Isolation
Patent:
5,814,866 →
Application:
08/617,293 →
Method of Forming High Quality Bonded Soi Wafers Without Epitaxy Using High Energy Implanted Buried Layers
Application:
08/818,920 →
Method for Cmos Latch-Up Improvement by Mev Billi (Buried Implanted Layer for Lateral Isolation) Plus Buried Layer Implantation
Patent:
5,821,589 →
Application:
08/822,537 →
Charge Exchange Cell
Patent:
5,838,012 →
Application:
08/822,543 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Jan 5, 1984
From: PURSER, KENNETH H.
To: GENERAL IONEX CORPORATION
Reel/Frame 004218/0155 →
Assignment of Assignors Interest.
Aug 20, 1984
From: MAHAWILI, IMAD
To: GENUS, INC., A CA CORP.
Reel/Frame 004291/0065 →
Assignment of Assignors Interest.
Oct 9, 1984
From: BOYS, DONALD R.
To: IODEP
Reel/Frame 004338/0525 →
Assignment of Assignors Interest.
Jul 26, 1985
From: NAYLOR, HARRY
To: GENERAL IONEX CORPORATION, A CORP OF MA
Reel/Frame 004463/0870 →
Assignment of Assignors Interest.
Oct 21, 1985
From: BRORS, DANIEL L.; FAIR, JAMES A.; MONNIG, KENNETH A.
To: GENUS INC., MOUNTAIN VIEW, CA., A CORP.OF
Reel/Frame 004472/0472 →
Assignment of Assignors Interest.
Mar 18, 1986
From: IODEP, INC., A CORP. OF CA.
To: GENUS, INC., A CORP. OF CA.
Reel/Frame 004523/0155 →
Assignment of Assignors Interest.
Aug 15, 1986
From: BRORS, DANIEL L.
To: GENUS, INC., A CA. CORP.
Reel/Frame 004591/0295 →
Assignment of Assignors Interest.
Sep 30, 1988
From: ADVANTAGE PRODUCTION TECHNOLOGY CORPORATION A DE CORP.
To: ADVANTAGE PRODUCTION TECHNOLOGY INC., A CORP. OF CA
Reel/Frame 004951/0301 →
Assignment of Assignors Interest.
Sep 30, 1988
From: ADVANTAGE PRODUCTION TECHNOLOGY CORPORATION, A CORP. OF NEW MEXICO
To: ADVANTAGE PRODUCTION TECHNOLOGY CORPORATION A CORP. OF DE
Reel/Frame 004951/0299 →
Assignment of Assignors Interest.
Nov 2, 1988
From: ADVANTAGE PRODUCTION TECHNOLOGY CORPORATION
To: ADVANTAGE PRODUCTION TECHNOLOGY INC., A CORP. OF CA
Reel/Frame 004996/0453 →
Security Interest
Mar 26, 1992
From: ADVANTAGE PRODUCTION TECHNOLOGY, INC., A CA CORP.
To: ADHILL LIMITED PARTNERSHIP; ADAVAL LIMITED PARTNERSHIP; ADVENT FUTURE LIMITED PARTNERSHIP; ADVENT INTERATNIONAL INVESTORS LIMITED PARTNERSHIP
Reel/Frame 006066/0114 →
Assignment of Assignors Interest.
Jun 15, 1992
From: ADVANTAGE PRODUCTION TECHNOLOGY, INC.
To: GENUS, INC.
Reel/Frame 006146/0823 →
Assignment of Assignors Interest.
Oct 7, 1992
From: TOKORO, NOBUHIRO
To: GENUS, INC.
Reel/Frame 006291/0804 →
Assignment of Assignors Interest.
Oct 19, 1992
From: ADVANTAGE PRODUCTION TECHNOLOGY, INC.
To: GENUS, INC.
Reel/Frame 006273/0925 →
Assignment of Assignors Interest.
Nov 9, 1992
From: SCHMITZ, JOHANNES J.; KANG, SIEN G.; RODE, EDWARD J.
To: GENUS, INC.
Reel/Frame 006321/0453 →
Assignment of Assignors Interest.
Nov 9, 1992
From: TURNER, NORMAN L.
To: GENUS INCORPORATED
Reel/Frame 006449/0701 →
Assignment of Assignors Interest.
Nov 23, 1992
From: SCHMITZ, JOHANNES J.; SCHOLZ, FREDERICK J.; TURNER, NORMAN L.; CHOW, RAYMOND L.
To: GANUS, INC
Reel/Frame 006347/0116 →
Assignment of Assignors Interest.
Mar 16, 1993
From: O'CONNOR, JOHN P.
To: GENUS, INC.
Reel/Frame 006468/0852 →
Assignment of Assignor's Interest
Sep 21, 1993
From: O'CONNOR, JOHN P.; SMITH, JOHN W.
To: GENUS, INC.
Reel/Frame 006707/0008 →
Assignment & Security Agreement; See Record for Details.
Oct 19, 1993
From: GENUS, INC.
To: SILICON VALLEY BANK
Reel/Frame 006790/0921 →
Assignment of Assignor's Interest
Nov 22, 1994
From: BORLAND, JOHN O.
To: GENUS, INC.
Reel/Frame 007229/0067 →
Assignment of Assignor's Interest
Mar 18, 1996
From: BORLAND, JOHN O.
To: GENUS, INC.
Reel/Frame 007926/0970 →
Assignment of Assignor's Interest
Mar 17, 1997
From: BORLAND, JOHN O.
To: GENUS, INC.
Reel/Frame 008550/0082 →
Assignment of Assignor's Interest
Mar 19, 1997
From: LAFONTAINE, MARVIN; TOKORO, NOBUHIRO; QUATTRINI, VICTOR; BISSONNETTE, DANIEL
To: GENUS, INC.
Reel/Frame 008584/0484 →
Assignment of Assignor's Interest
Mar 19, 1997
From: BORLAND, JOHN O.
To: GENUS, INC.
Reel/Frame 008533/0117 →