Assignment of Assignor's Interest

Recorded: 1997-10-02 Pages: 2

Assignor

TANAKA, KEI

Executed: 1997-09-22

Assignee

NEC CORPORATION

7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Structure and Method for Packaging a Semiconductor Device

Patent: 5,981,313 →

Application: 08/943,010 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.