Patent Assignment
Reel/Frame 034834/0806
Assignment of Assignor's Interest
Recorded: 2015-01-28
Pages: 8
Assignor
NEC CORPORATION
Executed: 2014-11-01
Assignee
GODO KAISHA IP BRIDGE 1
11TH FLOOR, DSM JIMBOCHO BUILDING, 1-11, KANDA JIMBOCHO, CHIYODA-KU, TOKYO, 101-0051, JAPAN
Covered Properties
(100)
Mcm (Multi Chip Module) Carrier with External Connection Terminals Bga (Ball Grid Array) Type Matrix Array Form
Patent:
5,784,264 →
Application:
08/562,848 →
Semiconductor Device Having Wiring Self-Aligned with Shield Structure and Process of Fabrication Thereof
Patent:
5,880,024 →
Application:
08/570,241 →
Semiconductor Device
Patent:
5,892,271 →
Application:
08/634,411 →
Method of Mounting a Semiconductor Device to a Substrate and a Mounted Structure
Patent:
5,874,780 →
Application:
08/686,550 →
Semiconductor Integrated Circuit Device Having Miniature Multi-Level Wiring Structure Low in Parasitic Capacitance
Patent:
5,717,251 →
Application:
08/689,088 →
Semiconductor Device Having Fets with Shared Source and Drain Regions
Patent:
5,973,377 →
Application:
08/777,348 →
Structure for Bonding Semiconductor Device to Substrate
Patent:
5,889,326 →
Application:
08/804,977 →
Process of Fabricating a Semiconductor Device Having Nitrogen-Containing Silicon Layer and Refractory Metal Layer
Patent:
6,048,795 →
Application:
08/840,550 →
Stack Module
Patent:
5,883,426 →
Application:
08/844,320 →
Device Mounting a Semiconductor Element on a Wiring Substrate and Manufacturing Method Thereof
Patent:
5,959,362 →
Application:
08/874,277 →
Structure and Method for Packaging a Semiconductor Device
Patent:
5,981,313 →
Application:
08/943,010 →
Semiconductor Device and Method for Manufacturing the Same
Patent:
6,100,597 →
Application:
08/968,187 →
Stacked Carrier Three-Dimensional Memory Module and Semiconductor Device Using the Same
Patent:
5,973,392 →
Application:
09/033,674 →
Semiconductor Device and Method for Producing Same
Patent:
6,025,648 →
Application:
09/061,165 →
Semiconductor Chip Carrier Having Partially Buried Conductive Pattern and Semiconductor Device Using the Same
Patent:
6,191,482 →
Application:
09/062,657 →
Method of Thermocompression Bonding a Supporting Substrate to a Semiconductor Bare Chip
Patent:
6,042,682 →
Application:
09/083,968 →
Method of Mounting a Semiconductor Device to a Substrate
Chip Size Package Semiconductor Device Without an Interposer and Method of Forming the Same
Stacked Module and Substrate Therefore
Patent:
5,995,379 →
Application:
09/177,384 →
"Device Mounting a Semiconductor Element on a Wiring Substrate and Manufacturing Method Thereof"
Patent:
6,063,649 →
Application:
09/247,617 →
Semiconductor Device Having Improved Short Channel Resistance
Semiconductor Device and Method for Manufacturing Same
Patent:
6,344,694 →
Application:
09/459,603 →
Method for Producing Shock-Resistant Stacked Semiconductor Device Module
Patent:
6,287,892 →
Application:
09/460,375 →
Highly Integrated Circuit Including Transmission Lines Which Have Excellent Characteristics
Patent:
6,433,408 →
Application:
09/477,963 →
Supporting Substrate for a Semiconductor Bare Chip
Semiconductor device and method for manufacturing the same
Patent:
6,326,234 →
Application:
09/537,499 →
Multi-Layered Wiring Layer and Method of Fabricating the Same
Patent:
6,538,324 →
Application:
09/596,415 →
Multi-Level Stacked Semiconductor Bear Chips with the Same Electrode Pad Patterns
Patent:
6,392,292 →
Application:
09/611,830 →
System Semiconductor Device and Method of Manufacturing the Same
Patent:
7,098,538 →
Application:
09/613,331 →
Method of Manufacturing Thin Film and Thin Film Capacitor
Patent:
6,440,751 →
Application:
09/653,141 →
Electronic Device Assembly and a Method of Connecting Electronic Devices Constituting the Same
Semiconductor Device Comprising Plural Isolated Channels in a Shallow Trench Isolation Region
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method for Fabricating Same
Packaging Method and Packaging Structures of Semiconductor Devices
Electronic Device Assembly and a Method of Connecting Electronic Devices Constituting the Same
Method for Mounting Flip Chip on Circuit Board Through Reliable Electrical Connections at Low Contact Resistance
Compact Semiconductor Device Capable of Mounting a Plurality of Semiconductor Chips with High Density and Method of Manufacturing the Same
Method of Forming a Silica Insulation Film with a Reduced Dielectric Constant
Chip Size Package Semiconductor Device and Method of Forming the Same
Semiconductor Device, Manufacturing Method and Apparatus for the Same
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Element with Conductive Columnar Projection and a Semiconductor Device with Conductive Columnar Projection
Semiconductor device with high dielectric constant insulating film and manufacturing method for the same
High Dielectric Constant Mosfet Device
Semiconductor Device and Its Manufacturing Method
Organic Siloxane Copolymer Film, Method and Deposition Apparatus for Producing Same, and Semiconductor Device Using Such Copolymer Film
Semiconductor Device, Wiring Substrate, and Method for Manufacturing Wiring Substrate
Semiconductor Device Having a Mis-Type Fet, and Methods for Manufacturing the Same and Forming a Metal Oxide Film
Semiconductor Device Having a Conductive Portion Below an Interlayer Insulating Film and Method for Producing the Same
Mis-Type Field-Effect Transistor
Semiconductor Device and Method for Manufacturing Same
Semiconductor Device and Manufacturing Method Thereof
High-Strength Solder Joint
Compact Semiconductor Device Capable of Mounting a Plurality of Semiconductor Chips with High Density and Method of Manufacturing the Same
System Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device, Manufacturing Method and Apparatus for the Same
Sheet Material and Wiring Board
Semiconductor Element Including a Wet Prevention Film
Semiconductor Device and Having Trench Interconnection
Semiconductor Element and a Producing Method for the Same, and a Semiconductor Device and a Producing Method for the Same
Semiconductor Device and Wiring Board
Semiconductor Device, Wiring Board, and Manufacturing Method Thereof
Semiconductor Device and Method of Fabricating the Same
Solder, and Mounted Components Using the Same
Semiconductor Device with High Dielectric Constant Insulating Film and Manufacturing Method for the Same
Semiconductor Device Including a Deflected Part
Semiconductor Device, Manufacturing Method and Apparatus for the Same
Method of Fabricating Organic Silicon Film, Semiconductor Device Including the Same, and Method of Fabricating the Semiconductor Device
Semiconductor Device and Method for Manufacturing Same
Semiconductor device and production method therefor
Application:
12/071,126 →
Publication:
US 2008/0203500
Semiconductor Device and Method for Manufacturing Same
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device and Manufacturing Process Therefor
Semiconductor Device and Fabrication Method
Electronic Device Package, Module, and Electronic Device
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Element and a Producing Method for the Same, and a Semiconductor Device and a Producing Method for the Same
Semiconductor Device, Method for Manufacturing Semiconductor Device and Apparatus for Manufacturing Semiconductor
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Device
Semiconductor Device
Semiconductor Chip and Semiconductor Device
Semiconductor Device, Manufacturing Method and Apparatus for the Same
Semiconductor Device and Manufacturing Method of the Same
Semiconductor Device
Semiconductor Device
Semiconductor Device
Semiconductor Device and Method of Manufacturing Same
Encapsulating Package, Printed Circuit Board, Electronic Device and Method for Manufacturing Encapsulating Package
Semiconductor Device and Manufacturing Method Thereof
Semiconductor device and manufacturing process therefor
Mount Board and Electronic Device
Semiconductor Device
Substrate for Semiconductor Package and Method of Manufacturing Thereof
Encapsulating Package, Printed Circuit Board, Electronic Device and Method for Manufacturing Encapsulating Package
Application:
13/933,278 →
Publication:
US 2013/0291380
Substrate for Semiconductor Package and Method of Manufacturing Thereof
Mount Board and Electronic Device
Semiconductor Device and Manufacturing Method Thereof
Application:
14/033,855 →
Publication:
US 2014/0024177
Semiconductor Device
Application:
14/468,522 →
Publication:
US 2014/0367863
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 27, 1995
From: TANIOKA, MICHINOBU
To: NEC CORPORATION
Reel/Frame 007791/0720 →
Assignment of Assignor's Interest
Dec 11, 1995
From: NAKAJIMA, TSUTOMU; HAYASHI, YOSHIHIRO
To: NEC CORPORATION
Reel/Frame 007865/0748 →
Assignment of Assignor's Interest
Apr 18, 1996
From: TAKEDA, HIDETOSHI; BONKOHARA, MANABU
To: NEC CORPORATION
Reel/Frame 007959/0244 →
Assignment of Assignor's Interest
Jul 26, 1996
From: MURAKAMI, TOMOO
To: NEC CORPORATION
Reel/Frame 008172/0243 →
Assignment of Assignor's Interest
Aug 5, 1996
From: HAYASHI, YOSHIHIRO; ONODERA, TAKAHIRO
To: NEC CORPORATION
Reel/Frame 008087/0166 →
Assignment of Assignor's Interest
Dec 27, 1996
From: MIZUTANI, HIROSHI
To: NEC CORPORATION
Reel/Frame 008373/0514 →
Assignment of Assignor's Interest
Feb 27, 1997
From: TANAKA, KEI
To: NEC CORPORATION
Reel/Frame 008411/0169 →
Assignment of Assignor's Interest
Feb 27, 1997
From: TANAKA, KEI
To: NEC CORPORATION
Reel/Frame 008511/0831 →
Assignment of Assignor's Interest
Jun 13, 1997
From: YOSHINO, RIEKA
To: NEC CORPORATION
Reel/Frame 008616/0990 →
Assignment of Assignor's Interest
Oct 2, 1997
From: TANAKA, KEI
To: NEC CORPORATION
Reel/Frame 008870/0601 →
Assignment of Assignor's Interest
Oct 9, 1997
From: TOKUNO, KENICHI; MORISAKI, IKUSHI; DOYA, AKIHIRO; BONKOHARA, MANABU
To: NEC CORPORATION
Reel/Frame 008791/0215 →
Assignment of Assignor's Interest
Nov 12, 1997
From: NAKAMURA, HIROFUMI
To: NEC CORPORATION
Reel/Frame 008888/0314 →
Assignment of Assignor's Interest
Mar 3, 1998
From: SENBA, NAOJI; SHIMADA, YUZO; MORIZAKI, IKUSI; KUSAMITU, HIDEKI
To: NEC CORPORATION
Reel/Frame 009024/0453 →
Assignment of Assignor's Interest
Apr 20, 1998
From: SENBA, NAOJI; TAKAHASHI, NOBUAKI
To: NEC CORPORATION
Reel/Frame 009118/0502 →
Assignment of Assignor's Interest
May 26, 1998
From: FUNAYA, TAKUO; MATSUI, KOJI
To: NEC CORPORATION
Reel/Frame 009192/0277 →
Assignment of Assignor's Interest
Aug 17, 1998
From: TAKAHASHI, NOBUAKI; KYOUGOKU, YOSHITAKA; HASHIMOTO, KATSUMASA; MIYAZAKI, SHINICHI
To: NEC CORPORATION
Reel/Frame 009397/0660 →
Assignment of Assignor's Interest
Oct 25, 1998
From: KYOUGOKU, YOSHITAKA; OHKUBO, KAZUHIKO
To: NEC CORPORATION
Reel/Frame 009551/0828 →
Assignment of Assignor's Interest
Nov 2, 1998
From: NAKAMURA, HIROFUMI; TAGO, MASAMOTO
To: NEC CORPORATION
Reel/Frame 009558/0503 →
Assignment of Assignor's Interest
Oct 4, 1999
From: TAKEUCHI, KIYOSHI; KUMASHIRO, SHIGETAKA
To: NEC CORPORATION
Reel/Frame 010303/0332 →
Assignment of Assignor's Interest
Dec 13, 1999
From: TSUDA, HIROSHI
To: NEC CORPORATION
Reel/Frame 010462/0311 →
Assignment of Assignor's Interest
Jan 5, 2000
From: ANJO, KENICHIRO; MIZUNO, MASAYUKI
To: NEC CORPORATION
Reel/Frame 010502/0238 →