Patent Assignment
Reel/Frame 009192/0277
Assignment of Assignor's Interest
Recorded: 1998-05-26
Pages: 2
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Thermocompression Bonding a Supporting Substrate to a Semiconductor Bare Chip
Patent:
6,042,682 →
Application:
09/083,968 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.