Granted Patent
Utility
US 6,590,287
· Confirmation No. 3151
PACKAGING METHOD AND PACKAGING STRUCTURES OF SEMICONDUCTOR DEVICES
Inventor:
Akira Ohuchi
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-08-01 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-08-01 | ADS |
Application Data Sheet | 1 | View | |
| 2001-08-01 | SPEC |
Specification | 39 | View | |
| 2001-08-01 | CLM |
Claims | 7 | View | |
| 2001-08-01 | ABST |
Abstract | 1 | View | |
| 2001-08-01 | DRW |
Drawings-only black and white line drawings | 12 | View | |
| 2001-08-01 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Akira Ohuchi
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
257/738
H10W74/012
Y02P70/50
H10W72/01225
H10W72/01251
H10W72/354
H10W74/15
H10W72/073
H10W72/241
H10W72/072
H10W72/01271
H10W72/90
H10W90/724
H05K3/346
H10W72/9415
H10W90/734
H10W72/352
H05K3/3436
H05K2201/10977
Prosecution
- Examiner
- CHAMBLISS, ALONZO
- Art Unit
- 2827
- Customer No.
- 466
- Docket No.
- NEC01P150
- Confirmation No.
- 3151
Foreign Priority
2000-232977
·
2000-08-01
·
JAPAN
2001-192940
·
2001-06-26
·
JAPAN
Publication
- Pub. No.
- US20020033525A1
- Pub. Date
- 2002-03-21
Patent Term Adjustment
-93days
No related applications found.
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Quick Facts
- Patent No.
- US 6,590,287
- App. No.
- 09/918,479
- Filed
- 2001-08-01
- Granted
- 2003-07-08
- Pub. No.
- US20020033525A1
- Examiner
- CHAMBLISS, ALONZO
- Art Unit
- 2827
- PTA
- -93 days
External Links