Patent Assignment
Reel/Frame 012048/0661
Assignment of Assignor's Interest
Recorded: 2001-08-01
Pages: 2
Assignor
OHUCHI, AKIRA
Executed: 2001-07-24
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Packaging Method and Packaging Structures of Semiconductor Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.