Assignment of Assignor's Interest

Recorded: 1997-02-27 Pages: 3

Assignor

TANAKA, KEI

Executed: 1997-02-26

Assignee

NEC CORPORATION

7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Structure for Bonding Semiconductor Device to Substrate

Patent: 5,889,326 →

Application: 08/804,977 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.