Patent Assignment
Reel/Frame 009558/0503
Assignment of Assignor's Interest
Recorded: 1998-11-02
Pages: 2
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Chip Size Package Semiconductor Device Without an Interposer and Method of Forming the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.