Assignment of Assignor's Interest

Recorded: 1997-06-13 Pages: 2

Assignor

YOSHINO, RIEKA

Executed: 1997-06-09

Assignee

NEC CORPORATION

7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Device Mounting a Semiconductor Element on a Wiring Substrate and Manufacturing Method Thereof

Patent: 5,959,362 →

Application: 08/874,277 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.