ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ENCAPSULATING PACKAGE
The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.
1 . A method for manufacturing an encapsulating package comprising a package main body section in which a first main body section and a second main body section are bonded via a hollow section, and an electronic device provided in the hollow section in the package main body section, the method comprising:
a mounting step of mounting an electronic device on the first main body section;
a bonding step of bonding the second main body section with the first main body section having the electronic device mounted thereon in the mounting step, so that the electronic device is arranged within the hollow section; and
a sealing step of, in a state where the first main body section and the second main body section have been bonded in the bonding step, partly heating a vicinity of a through hole formed in the second main body section, and melting a constituent material of the second main body section, to thereby block the through hole.
2 . A method for manufacturing an encapsulating package comprising a package main body section in which a first main body section and a second main body section are bonded via a hollow section, and an electronic device provided in the hollow section in the package main body section, the method comprising:
a mounting step of mounting an electronic device on the first main body section;
a bonding step of bonding the second main body section with the first main body section having the electronic device mounted thereon in the mounting step, so that the electronic device is arranged within the hollow section; and
a sealing step of, in a state where the first main body section and the second main body section have been bonded in the bonding step, partly heating a low-melting point section, which is provided in a vicinity of a through hole formed in the second main body section and has a melting point lower than that of the second main body section, and melting the low-melting point section, to thereby block the through hole.
3 . The method for manufacturing an encapsulating package according to claim 1 , comprising:
a mounting step of mounting a getter material capable of adsorbing gas molecules, at a position inside the package main body section where it is contactable with a laser beam irradiated through the through hole;
a vacuuming step of vacuuming inside of a vacuum chamber where the first main body section and the second main body section bonded in the bonding step are installed, to thereby vacuum inside the hollow section via the through hole; and
a heating step of irradiating a laser beam through the through hole to thereby heat the getter material.
4 . The method for manufacturing an encapsulating package according to claim 1 , wherein the sealing step is performed within a nitrogen atmosphere or in an inert gas atmosphere.
5 . The method for manufacturing an encapsulating package according claim 1 , comprising:
a vacuuming step of vacuuming inside of the vacuum chamber where the first main body section and the second main body section bonded in the bonding step are installed, to thereby vacuum inside the hollow section via the through hole,
wherein in the sealing step, a laser beam is irradiated in a vicinity of the through hole from outside of the vacuum chamber through a transmitting window provided in the vacuum chamber, and the through hole is blocked within a vacuum atmosphere, a nitrogen atmosphere, or an inert gas atmosphere.
6 . The method for manufacturing an encapsulating package according to claim 1 , wherein in the sealing step, a laser beam is irradiated in a vicinity of the through hole, and
an irradiation diameter of the laser beam is set greater than a diameter of the through hole.
7 . The method for manufacturing an encapsulating package according to claim 1 , wherein in the sealing step, a laser beam is irradiated in a vicinity of the through hole, and the method of irradiating the laser beam is a method of irradiating the laser beam so as to draw a circle centered on the through hole.