Patent Assignment
Reel/Frame 008877/0553
Assignment of Assignor's Interest
Recorded: 1997-12-29
Pages: 3
Assignees
MITSUBISHI MATERIALS CORPORATION
1-5-1, OHTEMACHI, CHIYODA-KU, TOKYO, JAPAN
MITSUBISHI MATERIALS SILICON CORPORATION
1-5-1, OHTEMACHI, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method and Apparatus for Cleaning and Separating Wafers Bonded to a Fixing Member
Patent:
5,976,954 →
Application:
08/869,145 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 5, 2011
From: MITSUBISHI MATERIALS SILICON CORPORATION
To: SUMITOMO MITSUBISHI SILICON CORPORATION
Reel/Frame 026074/0552 →
Change of Name
Apr 7, 2011
From: SUMITOMO MITSUBISHI SILICON CORPORATION
To: SUMCO CORPORATION
Reel/Frame 026100/0718 →
Assignment of Assignor's Interest
Oct 5, 2011
From: MITSUBISHE MATERIALS CORPORATION
To: SUMCO CORPORATION
Reel/Frame 027021/0207 →