IP Library Assignment 008911/0286
Patent Assignment
Reel/Frame 008911/0286

Assignment of Assignor's Interest

Recorded: 1997-12-05 Pages: 2
Assignor
LEE, JU-HWA
Executed: 1997-11-10
Assignee
LG SEMICON CO., LTD.
1, HYANGJEONG-DONG, HUNGDUK-GU CHEONGJU, CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF
Covered Property (1)
Ball Grid Array Semiconductor Package Comprised of Two Lead Frames
Patent: 6,201,294 →
Application: 08/985,959 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jul 11, 2000
From: LG SEMICON CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES, CO., LTD.
Reel/Frame 010951/0606 →