Patent Assignment
Reel/Frame 009107/0694
Assignment of Assignor's Interest
Recorded: 1998-04-16
Pages: 5
Assignee
LG SEMICON CO., LTD.
1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU, CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Substrate and Stackable Semiconductor Package and Fabrication Method Thereof
Patent:
6,137,163 →
Application:
09/060,707 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.