Granted Patent
Utility
US 6,137,163 · App. 09/060,707
Semiconductor substrate and stackable semiconductor package and fabrication method thereof
Inventors:
Jo Han Kim, Jin-Sung Kim
Patented Case
View Patent ↗
Granted: Oct 24, 2000
Filed: Apr 16, 1998
Inventors
Jo Han Kim
Jin-Sung Kim
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.