Patent Assignment
Reel/Frame 009276/0548
Assignment of Assignor's Interest
Recorded: 1998-06-22
Pages: 4
Assignors
TAKADA, KOUJI
Executed: 1998-04-28
YOKOZAWA, MASAMI
Executed: 1998-04-28
YOSHIDA, HIROYOSHI
Executed: 1998-04-28
SAKAGUCHI, SHIGEKI
Executed: 1998-04-28
Assignee
MATSUSHITA ELECTRONICS CORPORATION
1-1, SAIWAI-CHO, TAKATSUKI-SHI, OSAKA, 569, JAPAN
Covered Property
(1)
Lead Frame, Mold for Producing a Resin-Sealed Semiconductor Device, and Resin-Sealed Semiconductor Device Using Such a Lead Frame
Patent:
6,215,174 →
Application:
09/009,232 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Jan 28, 2002
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 012559/0130 →
Change of Name
Jan 8, 2014
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 031947/0358 →
Lien
Jan 13, 2014
From: COLLABO INNOVATIONS, INC.
To: PANASONIC CORPORATION
Reel/Frame 031997/0445 →
Assignment of Assignor's Interest
May 26, 2014
From: PANASONIC CORPORATION
To: COLLABO INNOVATIONS, INC.
Reel/Frame 033021/0806 →