Assignment of Assignor's Interest

Recorded: 1998-06-23 Pages: 5

Assignors

PAIK, KYUNG WOOK

Executed: 1998-05-08

KIM, JIN SU

Executed: 1998-05-08

KO, HYOUNG SOO

Executed: 1998-05-08

Assignee

LG SEMICON CO., LTD.

1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU, CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF

Covered Property (1)

Stacked Semiconductor Chip Package Having External Terminal Pads and Stackable Chips Having a Protection Layer

Patent: 6,188,129 →

Application: 09/046,136 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.