Patent Assignment
Reel/Frame 009292/0089
Assignment of Assignor's Interest
Recorded: 1998-06-25
Pages: 2
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
BUBAL-EUB, ICH'ON, SAN 136-1, AMI-RI, KYOUNGKI-DO, 467-860, KOREA, REPUBLIC OF
Covered Property
(1)
Metal Interconnection Structure of Semiconductor Device
Patent:
6,169,327 →
Application:
09/104,493 →
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 9, 2002
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 012795/0502 →
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Partial Release of Security Interest
Aug 10, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 023075/0054 →
Merger
Jul 22, 2011
From: CROSSTEK CAPITAL, LLC
To: INTELLECTUAL VENTURES II LLC
Reel/Frame 026637/0632 →
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest
Feb 2, 2020
From: INTELLECTUAL VENTURES II LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051777/0107 →