IP Library › Assignment 012795/0502
Patent Assignment
Reel/Frame 012795/0502

Change of Name

Recorded: 2002-04-09 Pages: 10
Assignor
Assignee
HYNIX SEMICONDUCTOR INC.
BUBAL-EUB, ICH'ON, SAN 136-1, AMI-RI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Properties (22)
Plasma Display Panel
Patent: 6,137,227 →
Application: 09/103,750 →
Method of Manufacturing Semiconductor Device for Preventing Electrostatic Discharge
Patent: 6,146,951 →
Application: 09/103,751 →
Method for Manufacturing Bicmos
Patent: 5,953,603 →
Application: 09/103,828 →
Method for Forming Barrier Rib of Plasma Display Panel
Patent: 6,010,830 →
Application: 09/104,102 →
Method for Optimizing Matching Network of Semiconductor Process Apparatus
Patent: 6,338,052 →
Application: 09/104,108 →
Metal Interconnection Structure of Semiconductor Device
Patent: 6,169,327 →
Application: 09/104,493 →
Method for Manufacturing a Semiconductor Memory Device
Patent: 6,121,079 →
Application: 09/104,561 →
Method for Measuring Width of Wire in Semiconductor Device Using Measuring-Pattern
Patent: 6,127,197 →
Application: 09/104,716 →
Lateral Bipolar Mode Field Effect Transistor
Patent: 6,084,254 →
Application: 09/105,397 →
Stacked Ball Grid Array Package
Patent: 6,072,700 →
Application: 09/107,759 →
Ac-Type Plasma Display Panel Using Single Substrate and Method for Maufacturing Thereof
Patent: 6,232,716 →
Application: 09/141,383 →
Stencil Mask
Patent: 6,316,151 →
Application: 09/442,983 →
Method of Forming Gate Electrode in Semiconductor Device
Patent: 6,194,294 →
Application: 09/466,740 →
Method of Forming Gate Electrode with Titanium Polycide Structure
Patent: 6,255,173 →
Application: 09/466,741 →
Method for Forming Gate Electrodes of Semiconductor Device Included a Separated Wn Layer
Patent: 6,340,629 →
Application: 09/466,752 →
Multi-Chip Package
Patent: 6,121,682 →
Application: 09/469,131 →
Cell Projection Mask
Patent: 6,319,636 →
Application: 09/471,972 →
Method for Fabricating a Memory Device with a High Dielectric Capacitor
Patent: 6,319,765 →
Application: 09/473,107 →
Method of Manufacturing Cmos Device
Patent: 6,258,722 →
Application: 09/473,471 →
Method for manufacturing lateral bipolar mode effect transistor
Patent: 6,358,786 →
Application: 09/591,965 →
Semiconductor memory device
Patent: 6,339,240 →
Application: 09/642,379 →
Measuring-Pattern for Measuring Width of Wire in Semiconductor Device
Patent: 6,462,565 →
Application: 09/644,992 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 24, 1998
From: KIM, HO-JUNG; SOHN, HONG-KYUN; PYUN, DEUK-SOO
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 009276/0084 →
Assignment of Assignor's Interest Jun 24, 1998
From: CHOI, HYUN MOOK
To: HUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 009276/0884 →
Assignment of Assignor's Interest Jun 24, 1998
From: KIM, JAE KAP
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 009276/0766 →
Assignment of Assignor's Interest Jun 24, 1998
From: CHOI, DEUK SUNG
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 009276/0162 →
Assignment of Assignor's Interest Jun 25, 1998
From: KIM, KIL HO; SHIN, KANG SUP; KIM, JONG IL
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 009288/0998 →
Assignment of Assignor's Interest Jun 25, 1998
From: CHOI, KYEONG KEUN; SIM, GYU CHEOL
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 009292/0089 →
Assignment of Assignor's Interest Jun 25, 1998
From: BAE, KOON HO
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 009292/0190 →
Assignment of Assignor's Interest Jun 25, 1998
From: KIM, JAE-KAP
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 009295/0235 →
Assignment of Assignor's Interest Jun 26, 1998
From: KIM, SEONG DONG
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 009292/0053 →
Assignment of Assignor's Interest Jun 30, 1998
From: TECK HOWN, NAM
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 009698/0039 →
Assignment of Assignor's Interest Aug 27, 1998
From: OK, DO YOUNG; PYUN, DEUK SOO
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 009671/0099 →
Corrective Assignment to Add Name of Second Conveying Party, Filed on 06-24-1998 Recorded on Reel 9276 Frame 0884. Assignor Hereby Confirms the Assignment of the Entire Interest. Aug 9, 1999
From: CHOI, HYUN MOOK; YOON, DAE JOONG
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 010241/0514 →
Assignment of Assignor's Interest Nov 18, 1999
From: KIM, CHEOL KYUN; BAIK, KI HO
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 010419/0732 →
Assignment of Assignor's Interest Dec 17, 1999
From: YEO, IN SEOK; LEE, JEAN HONG
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 010472/0606 →
Assignment of Assignor's Interest Dec 17, 1999
From: JANG, SE AUG
To: HYUNDAI ELECTRONIC INDUSTRIES, CO., LTD.
Reel/Frame 010473/0624 →
Assignment of Assignor's Interest Dec 17, 1999
From: LEE, JIN HONG
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 010473/0613 →
Assignment of Assignor's Interest Dec 21, 1999
From: KIM, JAE MYUN
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 010509/0101 →
Assignment of Assignor's Interest Dec 23, 1999
From: HAM, YOUNG MOG
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 010479/0670 →
Assignment of Assignor's Interest Dec 28, 1999
From: CHO, HO JIN; HONG, KWON
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 010515/0890 →
Assignment of Assignor's Interest Dec 28, 1999
From: KIM, JAE WHAN
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 010515/0850 →
Assignment of Assignor's Interest Jul 16, 2001
From: KIM, KIL HO; SHIN, KANG SUP; KIM, JONG IL
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 011984/0645 →
Assignment of Assignor's Interest Jul 16, 2001
From: KIM, JAE KAP
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 011984/0741 →
Assignment of Assignor's Interest Oct 9, 2001
From: KIM, SEONG DONG
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 012249/0451 →
Assignment of Assignor's Interest Jul 24, 2002
From: HYNIX SEMICONDUCTOR INC.
To: HYUNDAI PLASMA CO., LTD.
Reel/Frame 013117/0860 →
Change of Name Oct 12, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015242/0899 →