Patent Assignment
Reel/Frame 009698/0039
Assignment of Assignor's Interest
Recorded: 1998-06-30
Pages: 2
Assignor
TECK HOWN, NAM
Executed: 1998-06-20
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
CORPORATION OF KOREA, SAN 136-1, AMI-RI, BUBAL EUB, ICHON, KYOUNGKI-DO, 467-860, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Ball Grid Array Package
Patent:
6,072,700 →
Application:
09/107,759 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 9, 2002
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 012795/0502 →
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
Security Interest
Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
Release of Security Interest
Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 024563 Frame: 0807. Assignor(S) Hereby Confirms the Release by Secured Party.
Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →