Patent Assignment
Reel/Frame 009738/0032
Assignment of Assignor's Interest
Recorded: 1999-01-28
Pages: 3
Assignee
BOEING COMPANY, THE
MAIL STOP 13-08, POST OFFICE BOX 3707, SEATTLE, WASHINGTON, 98124
Covered Property
(1)
Method for Supporting During Fabrication Mechanical Members of Semi-Conductive Dies, Wafers, and Devices and an Associated Intermediate Device Assembly
Patent:
6,297,069 →
Application:
09/239,469 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.