IP Library › Assignment 010238/0417
Patent Assignment
Reel/Frame 010238/0417

Assignment of Assignor's Interest

Recorded: 1999-09-15 Pages: 3
Assignor
Assignee
HONEYWELL INC.
P.O. BOX 524, HONEYWELL PLAZA, MN 12 8251, MINNEAPOLIS, MINNESOTA, 55440
Covered Properties (17)
Method of Forming Detector Array Contact Bumps for Improved Lift Off of Excess Metal
Patent: 5,091,288 →
Application: 07/428,371 →
Method for Dicing Semiconductor Substrates Using an Exciner Laser Beam
Patent: 5,151,389 →
Application: 07/580,036 →
Method and Apparatus for Dicing Semiconductor Substrates Using an Excimer Laser Beam
Patent: 5,214,261 →
Application: 07/790,914 →
Amplitude Detection and Automatic Gain Control of a Sparsely Sampled Sinusoid by Adjustment of a Notch Filter
Patent: 5,576,976 →
Application: 08/116,860 →
Etch Control Seal for Dissolved Wafer Micromachining Process
Patent: 5,437,739 →
Application: 08/229,501 →
Transferable Solder Bumps for Interconnect and Assembly of Mcm Substrates
Patent: 5,440,239 →
Application: 08/232,969 →
Rate-Sensing Tuning Fork Design
Patent: 5,476,008 →
Application: 08/279,722 →
Micromachined Rate Sensor Comb Drive Device and Method
Patent: 5,530,342 →
Application: 08/315,471 →
Etch Control Seal for Dissolved Wafer Process
Patent: 5,509,974 →
Application: 08/434,153 →
Method of Anodic Wafer Bonding
Patent: 5,866,469 →
Application: 08/662,390 →
Demodulating Integrator/Demultiplexer
Patent: 5,703,596 →
Application: 08/691,766 →
Epitaxial Layer for Dissolved Wafer Micromachining Process
Patent: 5,854,122 →
Application: 08/816,651 →
Dissolved Wafer Fabrication Process and Associated Microelectromechanical Device Having a Support Substrate with Spacing Mesas
Patent: 6,143,583 →
Application: 09/093,492 →
Micromechanical Inertial Sensor
Patent: 5,920,012 →
Application: 09/097,766 →
Dimpled Contacts for Metal-to-Semiconductor Connections, and Methods for Fabricating Same
Patent: 6,078,103 →
Application: 09/182,387 →
Method for Supporting During Fabrication Mechanical Members of Semi-Conductive Dies, Wafers, and Devices and an Associated Intermediate Device Assembly
Patent: 6,297,069 →
Application: 09/239,469 →
Method and Apparatus for Amplifying Electrical Test Signals from a Micromechanical Device
Patent: 6,232,790 →
Application: 09/264,836 →
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Feb 16, 1990
From: ZAPPELLA, PIERINO I.; PEPE, ANGEL A.; FEWER, WILLIAM R.; BABCOCK, EUGENE J.
To: ROCKWELL INTERNATIONAL CORPORATION
Reel/Frame 005243/0787 →
Assignment of Assignors Interest. Oct 9, 1990
From: ZAPPELLA, PIERINO I.
To: ROCKWELL INTERNATIONAL CORPORATION
Reel/Frame 005465/0982 →
Assignment of Assignor's Interest Oct 28, 1993
From: WHITE, STANLEY A.
To: ROCKWELL INTERNATIONAL CORPORATION
Reel/Frame 006746/0867 →
Assignment of Assignor's Interest Apr 19, 1994
From: HAYS, KENNETH M.
To: ROCKWELL INTERNATIONAL CORPORATION
Reel/Frame 006978/0371 →
Assignment of Assignor's Interest Jul 11, 1994
From: ZAPPELLA, PIERINO I.; FEWER, WILLIAM R.
To: ROCKWELL INTERNATIONAL CORPORATION
Reel/Frame 007062/0472 →
Assignment of Assignor's Interest Nov 21, 1994
From: PINSON, JOHN C.
To: ROCKWELL INTERNATIONAL CORPORATION
Reel/Frame 007218/0365 →
Assignment of Assignor's Interest Dec 16, 1994
From: MURPHY, HUGH J.
To: ROCKWELL INTERNATIONAL CORPORATION
Reel/Frame 007262/0831 →
Assignment of Assignor's Interest May 2, 1995
From: HAYS, KENNETH M.
To: ROCKWELL INTERNATIONAL CORPORATION
Reel/Frame 007550/0821 →
Assignment of Assignor's Interest Jun 13, 1996
From: HAYS, KENNETH M.
To: ROCKWELL INTERNATIONAL CORPORATION
Reel/Frame 008042/0891 →
Assignment of Assignor's Interest Oct 28, 1996
From: WHITE, STANLEY A.
To: ROCKWELL INTERNATIONAL CORPORATION
Reel/Frame 008197/0828 →
Assignment of Assignor's Interest Aug 11, 1997
From: ROCKWELL INTERNATIONAL CORPORATION
To: BOEING NORTH AMERICAN, INC.
Reel/Frame 008662/0113 →
Security Interest Aug 26, 1997
From: ROCKWELL INTERNATIONAL CORPORATION
To: BOEING NORTH AMERICAN, INC.
Reel/Frame 008674/0308 →
Corrective Assignment to Correct the Conveying and the Receiving Party Recorded on Reel 8662, Frame 0113 Dec 24, 1997
From: HAYS, KENNETH M.; HALLECK, BRADLEY L.; WHITCOMB, EUGENE C.
To: BOEING COMPANY, THE
Reel/Frame 008816/0892 →
Assignment of Assignor's Interest Jun 8, 1998
From: HAYS, KEN MAXWELL
To: BOEING NORTH AMERICA
Reel/Frame 009238/0450 →
Assignment of Assignor's Interest Jun 16, 1998
From: PINSON, JOHN CARVER
To: BOEING NORTH AMERICAN
Reel/Frame 009299/0122 →
Correction of Previously Recorded Assignment at Reel 9238, Frame 0450 Sep 28, 1998
From: HAYS, KEN MAXWELL
To: BOEING NORTH AMERICAN, INC.
Reel/Frame 009478/0823 →
Merger Oct 5, 1998
From: ROCKWELL INTERNATIONAL CORPORATION
To: BOEING NORTH AMERICAN, INC.
Reel/Frame 009503/0349 →
Assignment of Assignor's Interest Oct 29, 1998
From: TURNER, GARY B.
To: MCDONNELL DOUGLAS CORPORATION
Reel/Frame 009563/0036 →
Security Interest Jan 14, 1999
From: CONEXANT SYSTEMS, INC.; BROOKTREE CORPORATION; BROOKTREE WORLDWIDE SALES CORPORATION; CONEXANT SYSTEMS WORLDWIDE, INC.
To: CREDIT SUISSE FIRST BOSTON
Reel/Frame 009719/0537 →
Assignment of Assignor's Interest Jan 28, 1999
From: ZAPPELLA, PIERINO ITALO; FEWER, WILLIAM RICHARD
To: BOEING COMPANY, THE
Reel/Frame 009738/0032 →
Assignment of Assignor's Interest Mar 8, 1999
From: BRYAN, ELIZABETH RUTH; DEADWYLER, MURDEN K.; GREEN, DAVID N.; HEIERTZ, JAMES L.
To: BOEING COMPANY, THE
Reel/Frame 009824/0317 →
Assignment of Assignor's Interest Mar 25, 1999
From: MCDONNELL DOUGLAS CORPORATION
To: BOEING COMPANY, THE
Reel/Frame 009846/0646 →
Assignment of Assignor's Interest Dec 15, 1999
From: ROCKWELL SCIENCE CENTER, LLC
To: CONEXANT SYSTEMS, INC.
Reel/Frame 010415/0761 →
Release of Security Interest Nov 5, 2001
From: CREDIT SUISSE FIRST BOSTON
To: CONEXANT SYSTEMS, INC.; BROOKTREE CORPORATION; BROOKTREE WORLDWIDE SALES CORPORATION; CONEXANT SYSTEMS WORLDWIDE, INC.
Reel/Frame 012252/0413 →