Patent Assignment
Reel/Frame 007062/0472
Assignment of Assignor's Interest
Recorded: 1994-07-11
Pages: 3
Assignee
ROCKWELL INTERNATIONAL CORPORATION
2201 SEAL BEACH BOULEVARD, SEAL BEACH, CALIFORNIA, 90740-8250
Covered Property
(1)
Transferable Solder Bumps for Interconnect and Assembly of Mcm Substrates
Patent:
5,440,239 →
Application:
08/232,969 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jan 14, 1999
From: CONEXANT SYSTEMS, INC.; BROOKTREE CORPORATION; BROOKTREE WORLDWIDE SALES CORPORATION; CONEXANT SYSTEMS WORLDWIDE, INC.
To: CREDIT SUISSE FIRST BOSTON
Reel/Frame 009719/0537 →
Assignment of Assignor's Interest
Sep 15, 1999
From: BOEING NORTH AMERICAN INC., FORMERLY KNOWN AS ROCKWELL INTERNATIONAL CORPORATION
To: HONEYWELL INC.
Reel/Frame 010238/0417 →
Assignment of Assignor's Interest
Dec 15, 1999
From: ROCKWELL SCIENCE CENTER, LLC
To: CONEXANT SYSTEMS, INC.
Reel/Frame 010415/0761 →
Release of Security Interest
Nov 5, 2001
From: CREDIT SUISSE FIRST BOSTON
To: CONEXANT SYSTEMS, INC.; BROOKTREE CORPORATION; BROOKTREE WORLDWIDE SALES CORPORATION; CONEXANT SYSTEMS WORLDWIDE, INC.
Reel/Frame 012252/0413 →