Patent Assignment
Reel/Frame 009238/0450
Assignment of Assignor's Interest
Recorded: 1998-06-08
Pages: 3
Assignor
HAYS, KEN MAXWELL
Executed: 1998-06-04
Assignee
BOEING NORTH AMERICA
P.O. BOX 2515, 201 SEAL BEACH BOULEVARD, SEAL BEACH, CALIFORNIA, 90740
Covered Property
(1)
Dissolved Wafer Fabrication Process and Associated Microelectromechanical Device Having a Support Substrate with Spacing Mesas
Patent:
6,143,583 →
Application:
09/093,492 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Correction of Previously Recorded Assignment at Reel 9238, Frame 0450
Sep 28, 1998
From: HAYS, KEN MAXWELL
To: BOEING NORTH AMERICAN, INC.
Reel/Frame 009478/0823 →
Assignment of Assignor's Interest
Sep 15, 1999
From: BOEING NORTH AMERICAN INC., FORMERLY KNOWN AS ROCKWELL INTERNATIONAL CORPORATION
To: HONEYWELL INC.
Reel/Frame 010238/0417 →