Patent Assignment
Reel/Frame 009751/0024
Assignment of Assignor's Interest
Recorded: 1999-02-04
Pages: 3
Assignor
YAMAGUCHI, YUKIO
Executed: 1999-01-27
Assignee
MATSUSHITA ELECTRONICS CORPORATION
1-1, SAIWAI-CHO, TAKATSUKI-SHI, OSAKA 569-1193, JAPAN
Covered Property
(1)
Lead Frame Method for Manufacturing the Frame Resin - Molded Semiconductor Device and Method for Manufacturing the Device
Patent:
6,166,430 →
Application:
09/244,073 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 14, 1999
From: YAMAGUCHI, YUKIO
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 010089/0199 →
Merger
Jan 18, 2002
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 012454/0436 →
Change of Name
Feb 8, 2016
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 037733/0463 →
Assignment of Assignor's Interest
Dec 13, 2016
From: PANASONIC CORPORATION
To: MICRO-OPTIMUS TECHNOLOGIES, INC.
Reel/Frame 040724/0373 →