Patent Assignment
Reel/Frame 009823/0437
Assignment of Assignor's Interest
Recorded: 1999-03-10
Pages: 3
Assignor
GOWAN, JAMES D.
Executed: 1997-07-16
Assignee
THERMAL COMPONENTS, A DIVISION OF INSILCO CORPORATION
2776 GUNTER PARK DRIVE EAST, SUITES R & S, MONTGOMERY, ALABAMA, 36109
Covered Property
(1)
Manifold for Heat Exchanger and Baffles Therefor
Patent:
6,145,589 →
Application:
09/265,569 →
Related Assignments
(23)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Mar 5, 2001
From: THERMASYS CORPORATION
To: BANK ONE, NA, AS ADMINISTRATIVE AGENT
Reel/Frame 011571/0852 →
Assignment of Assignor's Interest
Sep 10, 2001
From: THERMAL COMPONENTS
To: THERMASYS CORPORATION
Reel/Frame 012166/0240 →
Assignment of Assignor's Interest
Nov 13, 2002
From: INSILCO CORPORATION (INCLUDING THERMAL COMPONENTS, A DIVISION OF INSILCO CORPORATION)
To: THERMASYS CORPORATION
Reel/Frame 013484/0733 →
Security Agreement
Mar 14, 2005
From: THERMASYS CORPORATION
To: ABLECO FINANCE LLC
Reel/Frame 015766/0232 →
Assignment of Assignor's Interest
Apr 28, 2005
From: THERMASYS CORPORATION
To: SUN-TS ACQUISITION CORPORATION
Reel/Frame 016489/0691 →
Change of Name
May 11, 2005
From: SUN-TS ACQUISITION CORP.
To: THERMAYS CORPORATION
Reel/Frame 016536/0872 →
Assignment of Assignor's Interest
Jul 26, 2005
From: JP MORGAN CHASE BANK, N.A. (SUCCESSOR BY MERGER TO BANK ONE, NA)
To: THERMASYS CORPORATION
Reel/Frame 016301/0895 →
Release of Security Interests in Patents
Dec 20, 2010
From: THERMASYS CORPORATION
To: ABLECO FINANCE LLC
Reel/Frame 025526/0501 →
Release of Security Interest
Dec 20, 2010
From: ABLECO FINANCE LLC
To: THERMASYS CORPORATION
Reel/Frame 025529/0626 →
Security Agreement
Dec 22, 2010
From: THERMASYS CORPORATION
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS ADMINISTRATIVE AGENT
Reel/Frame 025549/0126 →
Security Agreement
Feb 7, 2012
From: THERMASYS CORPORATION
To: GENERAL ELECTRIC CAPITAL CORPORATION
Reel/Frame 027668/0438 →
Release of Security Interest
Feb 7, 2012
From: THERMASYS CORPORATION
To: GENERAL ELECTRIC CAPITAL CORPORATION
Reel/Frame 027665/0796 →
Security Agreement
May 7, 2013
From: THERMASYS CORPORATION
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS ADMINISTRATIVE AGENT
Reel/Frame 030361/0853 →
Release of Security Interest
May 7, 2013
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: THERMASYS CORPORATION
Reel/Frame 030361/0930 →
Change of Name
Jan 14, 2014
From: THERMASYS CORPORATION
To: API HEAT TRANSFER THERMASYS CORPORATION
Reel/Frame 031958/0784 →
Assignment of Intellectual Property Security Agreement
Sep 28, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION
To: ANTARES CAPITAL LP
Reel/Frame 036699/0715 →
Assignment and Assumption of Security Interest in Patents
Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
Release of Security Interest
Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
Release of Security Interest
Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
Release of Security Interest
Dec 31, 2018
From: ANTARES CAPITAL LP, AS ADMINISTRATIVE AGENT
To: API HEAT TRANSFER THERMASYS CORPORATION
Reel/Frame 047875/0707 →
Corrective Assignment to Correct the Remove Application 11759915 and Replace It with Application 11759935 Previously Recorded on Reel 037486 Frame 0517. Assignor(S) Hereby Confirms the Assignment and Assumption of Security Interest in Patents.
Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
Corrective Assignment to Correct the Remove Application 11759915 and Replace It with Application 11759935 Previously Recorded on Reel 040928 Frame 0001. Assignor(S) Hereby Confirms the Release of Security Interest.
Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
Corrective Assignment to Correct the Remove Application 11759915 and Replace It with Application 11759935 Previously Recorded on Reel 040925 Frame 0001. Assignor(S) Hereby Confirms the Release of Security Interest.
Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →