IP Library Assignment 009866/0690
Patent Assignment
Reel/Frame 009866/0690

Assignment of Assignor's Interest

Recorded: 1999-04-02 Pages: 3
Assignor
CYTEC TECHNOLOGY CORP.
Executed: 1998-11-23
Assignee
BULK MOLDING COMPOUNDS, INC.
1600 POWIS CT., WEST CHICAGO, ILLINOIS, 60185
Covered Property (1)
Injection Mouldable Thermosetting Composition Especially for Motor Vehicle Bodies, Method of Production and Method or Recycling
Patent: 5,767,177 →
Application: 08/537,824 →
Related Assignments (8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 5, 1996
From: OMENTE, PEDRO; LANDRU, LIONEL
To: SOCIETE SIMMACO
Reel/Frame 007878/0437 →
Assignment of Assignor's Interest Mar 12, 1998
From: SIMMACO SARL
To: FIBERITE, INC.
Reel/Frame 009042/0001 →
See Recording at Reel 9941 Frame 0512. (Re-Recorded to Correct Assignor and Assignee) Apr 8, 1998
From: OMENTE, PEDRO; LANDRU, LIONEL
To: CYTEC INDUSTRY INCORPORATED
Reel/Frame 009101/0082 →
Security Agreement Apr 2, 1999
From: BULK MOLDING COMPOUNDS, INC.
To: IPM, INC.; OWENS CORNING
Reel/Frame 009866/0668 →
Security Agreement Apr 2, 1999
From: BULK MOLDING COMPOUNDS, INC.
To: OLD KENT BANK
Reel/Frame 009866/0693 →
Corrective Assignment Apr 3, 1999
From: FIBERITE FRANCE
To: CYTEC TECHNOLOGY CORP.
Reel/Frame 010241/0163 →
Release of Security Interest Jun 4, 2004
From: OWENS CORNING; 1PM, INC.
To: BULK MOLDING COMPOUNDS, INC.
Reel/Frame 014709/0061 →
Release of Security Interest May 7, 2008
From: FIFTH THIRD BANK (CHICAGO), AS AGENT
To: BULK MOLDING COMPOUNDS, INC.
Reel/Frame 020909/0201 →