IP Library › Assignment 020909/0201
Patent Assignment
Reel/Frame 020909/0201

Release of Security Interest

Recorded: 2008-05-07 Pages: 5
Assignor
Assignee
BULK MOLDING COMPOUNDS, INC.
1600 POWIS COURT, WEST CHICAGO, ILLINOIS, 60185
Covered Properties (3)
Injection Mouldable Thermosetting Composition Especially for Motor Vehicle Bodies, Method of Production and Method or Recycling
Patent: 5,767,177 →
Application: 08/537,824 →
Composite Bipolar Plate for Electrochemical Cells
Patent: 6,248,467 →
Application: 09/359,829 →
Gas-Assisted Injection Molding of Thermosetting Polymers
Patent: 6,576,170 →
Application: 10/127,794 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 5, 1996
From: OMENTE, PEDRO; LANDRU, LIONEL
To: SOCIETE SIMMACO
Reel/Frame 007878/0437 →
Assignment of Assignor's Interest Mar 12, 1998
From: SIMMACO SARL
To: FIBERITE, INC.
Reel/Frame 009042/0001 →
See Recording at Reel 9941 Frame 0512. (Re-Recorded to Correct Assignor and Assignee) Apr 8, 1998
From: OMENTE, PEDRO; LANDRU, LIONEL
To: CYTEC INDUSTRY INCORPORATED
Reel/Frame 009101/0082 →
Assignment of Assignor's Interest Apr 2, 1999
From: CYTEC TECHNOLOGY CORP.
To: BULK MOLDING COMPOUNDS, INC.
Reel/Frame 009866/0690 →
Security Agreement Apr 2, 1999
From: BULK MOLDING COMPOUNDS, INC.
To: OLD KENT BANK
Reel/Frame 009866/0693 →
Security Agreement Apr 2, 1999
From: BULK MOLDING COMPOUNDS, INC.
To: IPM, INC.; OWENS CORNING
Reel/Frame 009866/0668 →
Corrective Assignment Apr 3, 1999
From: FIBERITE FRANCE
To: CYTEC TECHNOLOGY CORP.
Reel/Frame 010241/0163 →
Assignment of Assignor's Interest Jul 23, 1999
From: WILSON, MAHLON S.; BUSICK, DEANNA N.
To: REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE
Reel/Frame 010128/0935 →
Assignment of Assignor's Interest Apr 23, 2002
From: NUNNERY, LEN; ZAPPITELLI, FRANCIS; RIDDLE, JODY
To: BULK MOLDING COMPOUNDS, INC.
Reel/Frame 012821/0738 →
Release of Security Interest Jun 4, 2004
From: OWENS CORNING; 1PM, INC.
To: BULK MOLDING COMPOUNDS, INC.
Reel/Frame 014709/0061 →
Amended and Restated Patent Security Agreement Oct 14, 2005
From: BULK MOLDING COMPOUNDS, INC.; TMC ACQUISITION, INC.; MAXWELL PROPERTIES, LLC
To: FIFTH THIRD BANK
Reel/Frame 016641/0112 →
Assignment of Assignor's Interest Oct 19, 2007
From: REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE
To: LOS ALAMOS NATIONAL SECURITY, LLC
Reel/Frame 020012/0716 →
Security Agreement May 3, 2008
From: BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020897/0056 →
Security Agreement Jul 25, 2008
From: BULK MOLDING COMPOUNDS, INC.
To: DYMAS FUNDING COMPANY, LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 021291/0469 →
Security Agreement Oct 27, 2008
From: BULK MOLDING COMPOUNDS, INC.
To: MCG CAPITAL CORPORATION
Reel/Frame 021731/0909 →
Amended and Restated Assignment for Security Jan 3, 2011
From: DYMAS FUNDING COMPANY, LLC, AS ADMINISTRATIVE AGENT; MCG CAPITAL CORPORATION, AS COLLATERAL AGENT
To: CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
Reel/Frame 025575/0055 →
Release of Security Interest in Intellectual Property Collateral Mar 2, 2012
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0189 →
Release of Security Interest in Intellectual Property Mar 2, 2012
From: CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0203 →
Patent Security Agreement Mar 5, 2012
From: HGGC CITADEL PLASTICS INTERMEDIATE HOLDINGS, INC.; CITY ACQUISITION MERGER SUB, INC.; CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 027808/0818 →
Security Interest Nov 26, 2014
From: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 034478/0787 →
Release of Security Interest Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0985 →
Release of Security Interest Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC; THE MATRIXX GROUP, INCORPORATED; BULK MOLDING COMPOUNDS, INC.
Reel/Frame 035756/0526 →
Security Agreement Jun 2, 2015
From: A. SCHULMAN, INC.; BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 035808/0027 →
Confirmatory License Jul 7, 2015
From: LOS ALAMOS NATIONAL SECURITY
To: U.S. DEPARTMENT OF ENERGY
Reel/Frame 036003/0473 →
Release of Security Interest Aug 21, 2018
From: JPMORGAN CHASE BANK, N.A.
To: A. SCHULMAN, INC.; PREMIX, INC.; BULK MOLDING COMPOUNDS, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 046883/0607 →