IP Library › Assignment 027808/0818
Patent Assignment
Reel/Frame 027808/0818

Patent Security Agreement

Recorded: 2012-03-05 Pages: 10
Assignors
CITY ACQUISITION MERGER SUB, INC.
Executed: 2012-02-29
CITADEL PLASTICS HOLDINGS, INC.
Executed: 2012-02-29
CITADEL INTERMEDIATE HOLDINGS, LLC
Executed: 2012-02-29
THE MATRIXX GROUP, INCORPORATED
Executed: 2012-02-29
BULK MOLDING COMPOUNDS, INC.
Executed: 2012-02-29
Assignee
GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
500 WEST MONROE STREET, CHICAGO, ILLINOIS, 60661
Covered Properties (3)
Gas-Assisted Injection Molding of Thermosetting Polymers
Patent: 6,576,170 →
Application: 10/127,794 →
Conductive Adhesive Sealant for Bipolar Fuel Cell Separator Plate Assemblies
Patent: 6,933,333 →
Application: 10/458,038 →
Publication: US 2004/0254294
Encapsulated Electrically Resistive Heater
Patent: 7,047,626 →
Application: 10/891,849 →
Publication: US 2006/0011614
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest in Intellectual Property Mar 2, 2012
From: CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0203 →
Release of Security Interest in Intellectual Property Collateral Mar 2, 2012
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0189 →
Security Interest Nov 26, 2014
From: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 034478/0787 →
Release of Security Interest Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0985 →
Release of Security Interest Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC; THE MATRIXX GROUP, INCORPORATED; BULK MOLDING COMPOUNDS, INC.
Reel/Frame 035756/0526 →
Security Agreement Jun 2, 2015
From: A. SCHULMAN, INC.; BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 035808/0027 →
Release of Security Interest Aug 21, 2018
From: JPMORGAN CHASE BANK, N.A.
To: A. SCHULMAN, INC.; PREMIX, INC.; BULK MOLDING COMPOUNDS, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 046883/0607 →
Security Interest May 18, 2023
From: BULK MOLDING COMPOUNDS, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 063684/0563 →