Patent Assignment
Reel/Frame 063684/0563
Security Interest
Recorded: 2023-05-18
Pages: 13
Assignor
BULK MOLDING COMPOUNDS, INC.
Executed: 2014-11-05
Assignee
GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
500 WEST MONROE STREET, CHICAGO, ILLINOIS, 60661
Covered Properties
(2)
Gas-Assisted Injection Molding of Thermosetting Polymers
Patent:
6,576,170 →
Application:
10/127,794 →
Encapsulated Electrically Resistive Heater
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest
Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC; THE MATRIXX GROUP, INCORPORATED; BULK MOLDING COMPOUNDS, INC.
Reel/Frame 035756/0526 →
Release of Security Interest
Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0985 →
Security Agreement
Jun 2, 2015
From: A. SCHULMAN, INC.; BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 035808/0027 →
Release of Security Interest
Aug 21, 2018
From: JPMORGAN CHASE BANK, N.A.
To: A. SCHULMAN, INC.; PREMIX, INC.; BULK MOLDING COMPOUNDS, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 046883/0607 →