Patent Assignment
Reel/Frame 035756/0526
Release of Security Interest
Recorded: 2015-06-01
Pages: 7
Assignor
GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Executed: 2015-06-01
Assignees
CITADEL PLASTICS HOLDINGS, INC.
1600 POWIS COURT, WEST CHICAGO, ILLINOIS, 60185
CITADEL INTERMEDIATE HOLDINGS, LLC
1600 POWIS COURT, WEST CHICAGO, ILLINOIS, 60185
THE MATRIXX GROUP, INCORPORATED
15000 U.S. HIGHWAY 41 NORTH, EVANSVILLE, INDIANA, 47725
BULK MOLDING COMPOUNDS, INC.
1600 POWIS COURT, WEST CHICAGO, ILLINOIS, 60185
HGGC CITADEL PLASTICS INTERMEDIATE HOLDINGS, INC.
1950 UNIVERSITY AVENUE, E. PALO ALTO, CALIFORNIA, 94303
PREMIX, INC.
6151 WILSON MILLS ROAD, SUITE 310, HIGHLAND HEIGHTS, OHIO, 44143
QUANTUM COMPOSITES, INC.
6151 WILSON MILLS ROAD, SUITE 310, HIGHLAND HEIGHTS, OHIO, 44143
Covered Properties
(17)
Low Pressure Sheet Molding Compounds
Patent:
5,744,816 →
Application:
08/707,752 →
Process for Thickening Thermoset Resin Molding Compound Compositions
Patent:
5,854,317 →
Application:
08/769,454 →
Low Pressure Sheet Molding Compounds
Patent:
5,998,510 →
Application:
09/016,822 →
Process for Thickening Thermoset Resin Molding Compound Compositions
Patent:
6,040,391 →
Application:
09/141,931 →
Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds
Patent:
6,251,308 →
Application:
09/526,641 →
Highly Conductive Molding Compounds for Use as Fuel Cell Plates and the Resulting Products
Process of injection molding highly conductive molding compounds and an apparatus for this process
Gas-Assisted Injection Molding of Thermosetting Polymers
Patent:
6,576,170 →
Application:
10/127,794 →
Highly Conductive Molding Compounds Having an Increased Distribution of Large Size Graphite Particles
Conductive Adhesive Sealant for Bipolar Fuel Cell Separator Plate Assemblies
Encapsulated Electrically Resistive Heater
Molding Compounds for Use in Induction Heating Applications and Heating Elements Molded from These Compounds
Molding Compounds for Use in Furnace Blower Housings and Blower Housings Molded from These Compounds
Molding Compounds for Use in Induction Heating Applications and Heating Elements Molded from These Compounds
Flame and Smoke Spread Retardant Molding Compounds and Components Molded from These Compounds
Antimicrobial Flame and Smoke Spread Retardant Molding Compounds and Components Molded from These Compounds
Flame and Smoke Spread Retardant Molding Compounds and Components Molded from These Compounds
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Nov 26, 2014
From: PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS ADMINISTRATIVE AGENT
Reel/Frame 034478/0594 →
Security Interest
Nov 26, 2014
From: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 034478/0787 →
Assignment of Assignor's Interest
Feb 12, 2015
From: RINZ, JAMES E.
To: PREMIX INC.
Reel/Frame 034950/0854 →
Release of Security Interest
May 27, 2015
From: TEXAS CAPITAL BANK, N.A., AS ADMINISTRATIVE AGENT
To: QUANTUM COMPOSITES, INC.
Reel/Frame 035726/0437 →
Release of Security Interest
May 27, 2015
From: TEXAS CAPITAL BANK, N.A., AS ADMINISTRATIVE AGENT
To: PREMIX, INC.
Reel/Frame 035726/0392 →
Release of Security Interest
Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0985 →
Security Agreement
Jun 2, 2015
From: A. SCHULMAN, INC.; BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 035808/0027 →
Security Agreement
Aug 31, 2016
From: A. SCHULMAN, INC.; PREMIX, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 039889/0148 →
Security Agreement
May 1, 2018
From: QUANTUM COMPOSITES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 046478/0524 →
Release of Security Interest
Aug 21, 2018
From: JPMORGAN CHASE BANK, N.A.
To: A. SCHULMAN, INC.; PREMIX, INC.; BULK MOLDING COMPOUNDS, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 046883/0607 →
Change of Name
Sep 17, 2020
From: PREMIX, INC.
To: LYB PREMIX LLC
Reel/Frame 053802/0105 →
Change of Name
Apr 27, 2023
From: LYB PREMIX LLC
To: LYONDELLBASELL COMPOSITES LLC
Reel/Frame 063472/0717 →
Security Interest
May 18, 2023
From: BULK MOLDING COMPOUNDS, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 063684/0563 →