IP Library Assignment 046478/0524
Patent Assignment
Reel/Frame 046478/0524

Security Agreement

Recorded: 2018-05-01 Pages: 8
Assignor
QUANTUM COMPOSITES, INC.
Executed: 2018-05-01
Assignee
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
10 SOUTH DEARBORN, FLOOR L2, IL1-1145, CHICAGO, ILLINOIS, 60603
Covered Properties (3)
Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds
Patent: 6,251,308 →
Application: 09/526,641 →
Process of injection molding highly conductive molding compounds and an apparatus for this process
Patent: 6,365,069 →
Application: 09/879,327 →
Publication: US 2002/0005508
Multi-Piece Molded Composite Mandrel and Methods of Manufacturing
Patent: 9,631,452 →
Application: 14/247,111 →
Publication: US 2015/0285022
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 14, 2014
From: KIESEL, MICHAEL DALE; KACZMARCZYK, MATTHEW LOUIS; MCCLURE, JUSTIN JOHN; BENDICKSON, ROY B.
To: QUANTUM COMPOSITES, INC.
Reel/Frame 032670/0001 →
Security Interest Nov 26, 2014
From: PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS ADMINISTRATIVE AGENT
Reel/Frame 034478/0594 →
Security Interest Nov 26, 2014
From: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 034478/0787 →
Release of Security Interest May 27, 2015
From: TEXAS CAPITAL BANK, N.A., AS ADMINISTRATIVE AGENT
To: QUANTUM COMPOSITES, INC.
Reel/Frame 035726/0437 →
Release of Security Interest May 27, 2015
From: TEXAS CAPITAL BANK, N.A., AS ADMINISTRATIVE AGENT
To: PREMIX, INC.
Reel/Frame 035726/0392 →
Release of Security Interest Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC; THE MATRIXX GROUP, INCORPORATED; BULK MOLDING COMPOUNDS, INC.
Reel/Frame 035756/0526 →
Release of Security Interest Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0985 →
Release of Security Interest Aug 21, 2018
From: JPMORGAN CHASE BANK, N.A.
To: A. SCHULMAN, INC.; PREMIX, INC.; BULK MOLDING COMPOUNDS, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 046883/0607 →