IP Library Granted Patent US 6,365,069
Granted Patent Utility
US 6,365,069 · Confirmation No. 5089

Process of injection molding highly conductive molding compounds and an apparatus for this process

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Code Description Pages PDF
2017-04-21 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2017-04-21 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2017-04-06 PA.. Power of Attorney 1 View
2017-04-06 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2017-04-06 N417 Electronic Filing System Acknowledgment Receipt 2 View
2013-05-28 IMIS Miscellaneous Internal Document 1 View
2001-06-12 TRNA Transmittal of New Application 3 View
2001-06-12 SPEC Specification 61 View
2001-06-12 CLM Claims 5 View
2001-06-12 ABST Abstract 1 View
2001-06-12 DRW Drawings-only black and white line drawings 5 View
2001-06-12 OATH Oath or Declaration filed 4 View
2001-06-12 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,365,069
App. No.
09/879,327
Filed
2001-06-12
Granted
2002-04-02
Pub. No.
US20020005508A1
Art Unit
1751
PTA
-121 days