Patent Assignment
Reel/Frame 025765/0298
Security Agreement
Recorded: 2011-01-25
Received: 2011-01-25
Pages: 13
Assignor
QUANTUM COMPOSITES, INC.
Executed: 2010-12-30
Assignee
TEXAS CAPITAL BANK, N.A., AS ADMINISTRATIVE AGENT
2000 MCKINNEY AVENUE, SUITE 700, DALLAS, TX, 75201, UNITED STATES
Covered Properties
(3)
Highly Conductive Molding Compounds Having an Increased Distribution of Large Size Graphite Particles
Application:
10/135,955 →
Process of injection molding highly conductive molding compounds and an apparatus for this process
Application:
09/879,327 →
Highly Conductive Molding Compounds for Use as Fuel Cell Plates and the Resulting Products
Application:
09/849,629 →