Patent Assignment
Reel/Frame 012958/0141
Security Interest
Recorded: 2002-06-11
Received: 2002-06-11
Pages: 5
Assignor
QUANTUM COMPOSITES, INC.
Executed: 2002-05-17
Assignee
HELLER FINANCIAL, INC., AS AGENT
500 WEST MONROE STREET, CHICAGO, IL, 60661, UNITED STATES
Covered Properties
(3)
Highly conductive molding compounds having an increased distribution of large size graphite particles
Application:
60/341,337 →
Process of injection molding highly conductive molding compounds and an apparatus for this process
Application:
09/879,327 →
Highly Conductive Molding Compounds for Use as Fuel Cell Plates and the Resulting Products
Application:
09/849,629 →