Patent Assignment
Reel/Frame 046883/0607
Release of Security Interest
Recorded: 2018-08-21
Pages: 10
Assignor
JPMORGAN CHASE BANK, N.A.
Executed: 2018-08-21
Assignees
A. SCHULMAN, INC.
3637 RIDGEWOOD ROAD, FAIRLAWN, OHIO, 44333-1678
PREMIX, INC.
3637 RIDGEWOOD RD., FAIRLAWN, OHIO, 44333-1678
BULK MOLDING COMPOUNDS, INC.
1600 POWIS COURT, WEST CHICAGO, ILLINOIS, 60185
QUANTUM COMPOSITES, INC.
3637 RIDGEWOOD RD., FAIRLAWN, OHIO, 44333-1678
Covered Properties
(48)
Preparation of Curable Solid Polyester Resin Pellets and Powders
Patent:
4,451,610 →
Application:
06/302,814 →
Low Voc Unsaturated Polyester Systems and Uses Thereof
Patent:
5,688,867 →
Application:
08/431,512 →
Liquid Color System for Use in Rotational Molding and Method of Using the Same
Patent:
5,759,472 →
Application:
08/684,437 →
Low Pressure Sheet Molding Compounds
Patent:
5,744,816 →
Application:
08/707,752 →
Process for Thickening Thermoset Resin Molding Compound Compositions
Patent:
5,854,317 →
Application:
08/769,454 →
Polymer Blend Comprising Polypropylene
Patent:
5,969,027 →
Application:
08/904,742 →
Low Voc Unsaturated Polyester Systems and Uses Thereof
Patent:
5,874,503 →
Application:
08/916,478 →
Low Pressure Sheet Molding Compounds
Patent:
5,998,510 →
Application:
09/016,822 →
Multilayer Polymer Composite for Medical Applications
Patent:
6,599,595 →
Application:
09/130,755 →
Process for Thickening Thermoset Resin Molding Compound Compositions
Patent:
6,040,391 →
Application:
09/141,931 →
Ionomer/Rubber/Polyolefin Blend and Uses Thereof
Patent:
6,207,761 →
Application:
09/271,776 →
Metal Filled Concentrate
Patent:
6,194,507 →
Application:
09/385,198 →
Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds
Patent:
6,251,308 →
Application:
09/526,641 →
Adhesive Composition Primarily Intended for Use in Medical Applications
Multilayer Composite Structure with Formulated Acrylic Cap
Multilayer Structure with Acrylic Cap Layer, Polyolefin Core Layer, and Intermediate Tie Layer
Process of injection molding highly conductive molding compounds and an apparatus for this process
Method of Forming Lenticular Sheets
Polymer Compositions Comprising Polyolefins and Reaction Products of a Polyolefin and an Unsaturated Carboxylic Reagent and Articles Made Therefrom
Color Concentrate
Patent:
6,646,038 →
Application:
10/055,808 →
Gas-Assisted Injection Molding of Thermosetting Polymers
Patent:
6,576,170 →
Application:
10/127,794 →
Medical Multilayer Film Structure
Glass Reinforced Nylon Blend with Improved Knitline Strength
Patent:
6,759,474 →
Application:
10/378,562 →
Thermoplastic Composition
Multilayer Polymer Structure
Conductive Adhesive Sealant for Bipolar Fuel Cell Separator Plate Assemblies
Impact Modified Thermoplastic Olefin Compositions
Impact Modified Polyolefin Compositions
Thermoplastic Olefin Compositions and Injection Molded Articles Made Thereof
Molding Compounds for Use in Induction Heating Applications and Heating Elements Molded from These Compounds
Molding Compounds for Use in Furnace Blower Housings and Blower Housings Molded from These Compounds
Weatherable Glass Fiber Reinforced Polyolefin Composition
Molding compositions for use in forward lighting applications and headlight components molded therefrom
Application:
11/544,216 →
Publication:
US 2007/0083005
Molding Compounds for Use in Induction Heating Applications and Heating Elements Molded from These Compounds
Flame and Smoke Spread Retardant Molding Compounds and Components Molded from These Compounds
Antimicrobial Flame and Smoke Spread Retardant Molding Compounds and Components Molded from These Compounds
Multilayer Clear Over Color Polyolefin Sheets and Layered Backing Structure
Multilayer Clear Over Color Polyolefin Sheets and Layered Backing Structure
Application:
12/548,954 →
Publication:
US 2009/0317649
Optimized Flavored Polymeric Compositions
Application:
12/583,979 →
Publication:
US 2010/0055233
Flavored Polymeric Articles
Application:
13/039,598 →
Publication:
US 2011/0230587
Flame and Smoke Spread Retardant Molding Compounds and Components Molded from These Compounds
Multilayer Clear Over Color Polyolefin Sheets and Layered Backing Structure
Polymer Composite Foams
Methods and Compositions for Using Temporary Compacted Materials as Well Servicing Fluids in a Subterranean Formation
Multi-Piece Molded Composite Mandrel and Methods of Manufacturing
Polymer Foams
Application:
61/737,874 →
Composite Composition For Use In Forming Barrier Constructions
Application:
61/921,162 →
Composite Composition for Use in Forming Barrier Constructions
Application:
62/009,939 →
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest in Intellectual Property
Mar 2, 2012
From: CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0203 →
Release of Security Interest in Intellectual Property Collateral
Mar 2, 2012
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0189 →
Patent Security Agreement
Mar 5, 2012
From: HGGC CITADEL PLASTICS INTERMEDIATE HOLDINGS, INC.; CITY ACQUISITION MERGER SUB, INC.; CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 027808/0818 →
Release of Security Interest
Jul 1, 2014
From: PNC BANK, NATIONAL ASSOCIATION
To: FERRO CORPORATION
Reel/Frame 033267/0895 →
Assignment of Assignor's Interest
Jul 11, 2014
From: FERRO CORPORATION
To: A. SCHULMAN, INC.
Reel/Frame 033295/0142 →
Security Interest
Nov 26, 2014
From: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 034478/0787 →
Security Interest
Nov 26, 2014
From: PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS ADMINISTRATIVE AGENT
Reel/Frame 034478/0594 →
Assignment of Assignor's Interest
Feb 12, 2015
From: RINZ, JAMES E.
To: PREMIX INC.
Reel/Frame 034950/0854 →
Release of Security Interest
May 27, 2015
From: TEXAS CAPITAL BANK, N.A., AS ADMINISTRATIVE AGENT
To: QUANTUM COMPOSITES, INC.
Reel/Frame 035726/0437 →
Release of Security Interest
May 27, 2015
From: TEXAS CAPITAL BANK, N.A., AS ADMINISTRATIVE AGENT
To: PREMIX, INC.
Reel/Frame 035726/0392 →
Release of Security Interest
Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC; THE MATRIXX GROUP, INCORPORATED; BULK MOLDING COMPOUNDS, INC.
Reel/Frame 035756/0526 →
Release of Security Interest
Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0985 →
Security Agreement
Jun 2, 2015
From: A. SCHULMAN, INC.; BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 035808/0027 →
Security Agreement
Aug 31, 2016
From: A. SCHULMAN, INC.; PREMIX, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 039889/0148 →
Security Agreement
May 1, 2018
From: QUANTUM COMPOSITES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 046478/0524 →
Change of Name
Jul 14, 2020
From: A. SCHULMAN, INC.
To: LYONDELLBASELL ADVANCED POLYMERS INC.
Reel/Frame 053202/0238 →
Security Interest
May 18, 2023
From: BULK MOLDING COMPOUNDS, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 063684/0563 →