IP Library › Assignment 027795/0189
Patent Assignment
Reel/Frame 027795/0189

Release of Security Interest in Intellectual Property Collateral

Recorded: 2012-03-02 Pages: 9
Assignor
Assignees
THE MATRIXX GROUP INCORPORATED
15000 U.S. HIGHWAY 41 NORTH, EVANSVILLE, INDIANA, 47725
BULK MOLDING COMPOUNDS, INC.
1600 POWIS COURT, WEST CHICAGO, ILLINOIS, 60185
CITADEL INTERMEDIATE HOLDINGS, LLC
150 N. RADNOR CHESTER ROAD, SUITE F-200, RADNOR, PENNSYLVANIA, 19087
Covered Properties (3)
Gas-Assisted Injection Molding of Thermosetting Polymers
Patent: 6,576,170 →
Application: 10/127,794 →
Conductive Adhesive Sealant for Bipolar Fuel Cell Separator Plate Assemblies
Patent: 6,933,333 →
Application: 10/458,038 →
Publication: US 2004/0254294
Encapsulated Electrically Resistive Heater
Patent: 7,047,626 →
Application: 10/891,849 →
Publication: US 2006/0011614
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest in Intellectual Property Mar 2, 2012
From: CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0203 →
Patent Security Agreement Mar 5, 2012
From: HGGC CITADEL PLASTICS INTERMEDIATE HOLDINGS, INC.; CITY ACQUISITION MERGER SUB, INC.; CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 027808/0818 →
Security Interest Nov 26, 2014
From: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 034478/0787 →
Release of Security Interest Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0985 →
Release of Security Interest Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC; THE MATRIXX GROUP, INCORPORATED; BULK MOLDING COMPOUNDS, INC.
Reel/Frame 035756/0526 →
Security Agreement Jun 2, 2015
From: A. SCHULMAN, INC.; BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 035808/0027 →
Release of Security Interest Aug 21, 2018
From: JPMORGAN CHASE BANK, N.A.
To: A. SCHULMAN, INC.; PREMIX, INC.; BULK MOLDING COMPOUNDS, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 046883/0607 →
Security Interest May 18, 2023
From: BULK MOLDING COMPOUNDS, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 063684/0563 →