IP Library › Granted Patent US 6,933,333
Granted Patent B2
US 6,933,333 · App. 10/458,038 · Granted Aug 23, 2005

Conductive adhesive sealant for bipolar fuel cell separator plate assemblies

Assignee: Bulk Molding Compounds, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,933,333
App. No.
10/458,038
Granted
Aug 23, 2005
Kind
B2
Abstract

A conductive adhesive sealant comprising vinyl ester resin or polyester resin, graphite powder, peroxide free-radical initiator, milled carbon fiber, and a quinone-based inhibitor such as para benzoquinone.

Claims (22)

1. a liquid conductive adhesive sealant for bipolar fuel cell separator plate assemblies, comprising:

(a) approximately 35% to 80% by weight of thermosetting vinyl ester resin,

(b) approximately 10% to 35% by weight of graphite powder,

(c) approximately 0.1% to 10% by weight of a peroxide free-radical initiator based on the weight of said thermosetting resin,

(d) approximately 2% to 20% by weight of milled carbon fiber based on the weight of said thermosetting resin.

2. A conductive adhesive sealant according to claim 1 , wherein:

(e) said thermosetting resin has a viscosity less than 20,000 cps as measured with a Brookfield viscometer using a T-bar “B” at 20 rpm.

3. A conductive adhesive sealant according to claim 1 , wherein:

(e) said graphite powder has a median particle size less than 100 microns.

4. A conductive adhesive sealant according to claim 1 , wherein:

(e) said milled carbon fiber has a median length less than ¼ inch.

5. A liquid conductive adhesive sealant for bipolar fuel cell separator plate assemblies, comprising:

(a) approximately 66% by weight of thermosetting vinyl ester resin,

(b) approximately 25% by weight of graphite powder,

(c) approximately 2% by weight of peroxide free-radical initiator,

(d) approximately 6% by weight of milled carbon fiber.

6. A conductive adhesive sealant according to claim 5 , wherein:

(e) said thermosetting resin has a viscosity less than 20,000 cps as measured with a Brookfield viscometer using a T-bar “B” at 20 rpm.

7. A conductive adhesive sealant according to claim 5 , wherein:

(e) said graphite powder has a median particle size less than 100 microns.

8. A conductive adhesive sealant according to claim 5 , wherein:

(e) said milled carbon fiber has a median length less than ¼ inch.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Aug 21, 2018
From: JPMORGAN CHASE BANK, N.A.
To: A. SCHULMAN, INC.; PREMIX, INC.; BULK MOLDING COMPOUNDS, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 046883/0607 →
SECURITY AGREEMENT Recorded Jun 2, 2015
From: A. SCHULMAN, INC.; BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 035808/0027 →
RELEASE OF SECURITY INTEREST Recorded Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC; THE MATRIXX GROUP, INCORPORATED; BULK MOLDING COMPOUNDS, INC.; HGGC CITADEL PLASTICS INTERMEDIATE HOLDINGS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0526 →
RELEASE OF SECURITY INTEREST Recorded Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0985 →
SECURITY INTEREST Recorded Nov 26, 2014
From: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 034478/0787 →
PATENT SECURITY AGREEMENT Recorded Mar 5, 2012
From: HGGC CITADEL PLASTICS INTERMEDIATE HOLDINGS, INC.; CITY ACQUISITION MERGER SUB, INC.; CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC; THE MATRIXX GROUP, INCORPORATED; BULK MOLDING COMPOUNDS, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 027808/0818 →
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Mar 2, 2012
From: CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0203 →
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY COLLATERAL Recorded Mar 2, 2012
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0189 →
AMENDED AND RESTATED ASSIGNMENT FOR SECURITY Recorded Jan 3, 2011
From: DYMAS FUNDING COMPANY, LLC, AS ADMINISTRATIVE AGENT; MCG CAPITAL CORPORATION, AS COLLATERAL AGENT
To: CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
Reel/Frame 025575/0055 →
SECURITY AGREEMENT Recorded Oct 27, 2008
From: BULK MOLDING COMPOUNDS, INC.
To: MCG CAPITAL CORPORATION
Reel/Frame 021731/0909 →
SECURITY AGREEMENT Recorded Jul 25, 2008
From: BULK MOLDING COMPOUNDS, INC.
To: DYMAS FUNDING COMPANY, LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 021291/0469 →
SECURITY AGREEMENT Recorded May 3, 2008
From: BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020897/0056 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2003
From: CLULOW, JOHN; RIDDLE, JODY; ZAPPITELLI, FRANCIS
To: BULK MOLDING COMPOUNDS INC.
Reel/Frame 014164/0392 →
Continuity (1)
Related Publication 20040254294A1 · Dec 16, 2004