Patent Assignment
Reel/Frame 014164/0392
Assignment of Assignor's Interest
Recorded: 2003-06-11
Pages: 2
Assignors
CLULOW, JOHN
Executed: 2003-06-06
RIDDLE, JODY
Executed: 2003-06-06
ZAPPITELLI, FRANCIS
Executed: 2003-06-06
Assignee
BULK MOLDING COMPOUNDS INC.
1600 POWLS COURT, WEST CHICAGO, ILLINOIS, 60185
Covered Property
(1)
Conductive Adhesive Sealant for Bipolar Fuel Cell Separator Plate Assemblies
Related Assignments
(12)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 3, 2008
From: BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020897/0056 →
Security Agreement
Jul 25, 2008
From: BULK MOLDING COMPOUNDS, INC.
To: DYMAS FUNDING COMPANY, LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 021291/0469 →
Security Agreement
Oct 27, 2008
From: BULK MOLDING COMPOUNDS, INC.
To: MCG CAPITAL CORPORATION
Reel/Frame 021731/0909 →
Amended and Restated Assignment for Security
Jan 3, 2011
From: DYMAS FUNDING COMPANY, LLC, AS ADMINISTRATIVE AGENT; MCG CAPITAL CORPORATION, AS COLLATERAL AGENT
To: CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
Reel/Frame 025575/0055 →
Release of Security Interest in Intellectual Property
Mar 2, 2012
From: CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0203 →
Release of Security Interest in Intellectual Property Collateral
Mar 2, 2012
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0189 →
Patent Security Agreement
Mar 5, 2012
From: HGGC CITADEL PLASTICS INTERMEDIATE HOLDINGS, INC.; CITY ACQUISITION MERGER SUB, INC.; CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 027808/0818 →
Security Interest
Nov 26, 2014
From: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 034478/0787 →
Release of Security Interest
Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0985 →
Release of Security Interest
Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC; THE MATRIXX GROUP, INCORPORATED; BULK MOLDING COMPOUNDS, INC.
Reel/Frame 035756/0526 →
Security Agreement
Jun 2, 2015
From: A. SCHULMAN, INC.; BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 035808/0027 →
Release of Security Interest
Aug 21, 2018
From: JPMORGAN CHASE BANK, N.A.
To: A. SCHULMAN, INC.; PREMIX, INC.; BULK MOLDING COMPOUNDS, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 046883/0607 →