Patent Assignment
Reel/Frame 020897/0056
Security Agreement
Recorded: 2008-05-03
Pages: 6
Assignor
BULK MOLDING COMPOUNDS, INC.
Executed: 2008-05-02
Assignee
JPMORGAN CHASE BANK, N.A.
10 S. DEARBORN STREET, 22ND FLOOR, CHICAGO, ILLINOIS, 60603
Covered Properties
(3)
Gas-Assisted Injection Molding of Thermosetting Polymers
Patent:
6,576,170 →
Application:
10/127,794 →
Conductive Adhesive Sealant for Bipolar Fuel Cell Separator Plate Assemblies
Encapsulated Electrically Resistive Heater
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 23, 2002
From: NUNNERY, LEN; ZAPPITELLI, FRANCIS; RIDDLE, JODY
To: BULK MOLDING COMPOUNDS, INC.
Reel/Frame 012821/0738 →
Assignment of Assignor's Interest
Jun 11, 2003
From: CLULOW, JOHN; RIDDLE, JODY; ZAPPITELLI, FRANCIS
To: BULK MOLDING COMPOUNDS INC.
Reel/Frame 014164/0392 →
Assignment of Assignor's Interest
Jul 15, 2004
From: CLULOW, JOHN
To: BULK MOLDING COMPOUNDS, INC.
Reel/Frame 015586/0004 →
Amended and Restated Patent Security Agreement
Oct 14, 2005
From: BULK MOLDING COMPOUNDS, INC.; TMC ACQUISITION, INC.; MAXWELL PROPERTIES, LLC
To: FIFTH THIRD BANK
Reel/Frame 016641/0112 →
Release of Security Interest
May 7, 2008
From: FIFTH THIRD BANK (CHICAGO), AS AGENT
To: BULK MOLDING COMPOUNDS, INC.
Reel/Frame 020909/0201 →
Security Agreement
Jul 25, 2008
From: BULK MOLDING COMPOUNDS, INC.
To: DYMAS FUNDING COMPANY, LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 021291/0469 →
Security Agreement
Oct 27, 2008
From: BULK MOLDING COMPOUNDS, INC.
To: MCG CAPITAL CORPORATION
Reel/Frame 021731/0909 →
Amended and Restated Assignment for Security
Jan 3, 2011
From: DYMAS FUNDING COMPANY, LLC, AS ADMINISTRATIVE AGENT; MCG CAPITAL CORPORATION, AS COLLATERAL AGENT
To: CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
Reel/Frame 025575/0055 →
Release of Security Interest in Intellectual Property
Mar 2, 2012
From: CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0203 →
Release of Security Interest in Intellectual Property Collateral
Mar 2, 2012
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: THE MATRIXX GROUP INCORPORATED; BULK MOLDING COMPOUNDS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
Reel/Frame 027795/0189 →
Patent Security Agreement
Mar 5, 2012
From: HGGC CITADEL PLASTICS INTERMEDIATE HOLDINGS, INC.; CITY ACQUISITION MERGER SUB, INC.; CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 027808/0818 →
Security Interest
Nov 26, 2014
From: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 034478/0787 →
Release of Security Interest
Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0985 →
Release of Security Interest
Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC; THE MATRIXX GROUP, INCORPORATED; BULK MOLDING COMPOUNDS, INC.
Reel/Frame 035756/0526 →
Security Agreement
Jun 2, 2015
From: A. SCHULMAN, INC.; BULK MOLDING COMPOUNDS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 035808/0027 →
Release of Security Interest
Aug 21, 2018
From: JPMORGAN CHASE BANK, N.A.
To: A. SCHULMAN, INC.; PREMIX, INC.; BULK MOLDING COMPOUNDS, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 046883/0607 →
Security Interest
May 18, 2023
From: BULK MOLDING COMPOUNDS, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 063684/0563 →