Patent Assignment
Reel/Frame 034950/0854
Assignment of Assignor's Interest
Recorded: 2015-02-12
Pages: 2
Assignor
RINZ, JAMES E.
Executed: 1996-12-16
Assignee
PREMIX INC.
P.O. BOX 281, NORTH KINGSVILLE, OHIO, 44068
Covered Property
(1)
Process for Thickening Thermoset Resin Molding Compound Compositions
Patent:
6,040,391 →
Application:
09/141,931 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 26, 2014
From: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 034478/0787 →
Security Interest
Nov 26, 2014
From: PREMIX, INC.; QUANTUM COMPOSITES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS ADMINISTRATIVE AGENT
Reel/Frame 034478/0594 →
Release of Security Interest
May 27, 2015
From: TEXAS CAPITAL BANK, N.A., AS ADMINISTRATIVE AGENT
To: PREMIX, INC.
Reel/Frame 035726/0392 →
Release of Security Interest
Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: BULK MOLDING COMPOUNDS, INC.; PREMIX, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 035756/0985 →
Release of Security Interest
Jun 1, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: CITADEL PLASTICS HOLDINGS, INC.; CITADEL INTERMEDIATE HOLDINGS, LLC; THE MATRIXX GROUP, INCORPORATED; BULK MOLDING COMPOUNDS, INC.
Reel/Frame 035756/0526 →
Security Agreement
Aug 31, 2016
From: A. SCHULMAN, INC.; PREMIX, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 039889/0148 →
Release of Security Interest
Aug 21, 2018
From: JPMORGAN CHASE BANK, N.A.
To: A. SCHULMAN, INC.; PREMIX, INC.; BULK MOLDING COMPOUNDS, INC.; QUANTUM COMPOSITES, INC.
Reel/Frame 046883/0607 →