Patent Assignment
Reel/Frame 009871/0290
Assignment of Assignor's Interest
Recorded: 1999-04-06
Pages: 4
Assignors
TAYLOR, E. JENNINGS
Executed: 1999-03-21
SUN, JENNY J.
Executed: 1999-03-21
ZHOU, CHENGDONG
Executed: 1999-03-21
Assignee
FARADAY TECHNOLOGY, INC
315 HULS DRIVE, CLAYTON, OHIO, 45315
Covered Property
(1)
Electrodeposition of Metals in Small Recesses for Manufacture of High Density Interconnects Using Reverse Puls Plating
Patent:
6,210,555 →
Application:
09/239,811 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 25, 2001
From: FARADAY TECHNOLOGY, INC.
To: FARADAY TECHNOLOGY MARKETING GROUP, LLC
Reel/Frame 011471/0490 →
Assignment of Assignor's Interest
May 29, 2008
From: FARADAY TECHNOLOGY MARKETING GROUP, LLC
To: FARADAY TECHNOLOGY, INC.
Reel/Frame 021006/0905 →
Assignment of Assignor's Interest
May 30, 2008
From: FARADAY TECHNOLOGY MARKETING GROUP, LLC
To: FARADAY TECHNOLOGY, INC.
Reel/Frame 021021/0177 →
Assignment of Assignor's Interest
Oct 7, 2009
From: FARADAY TECHNOLOGY, INC
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023337/0688 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →