Patent Assignment
Reel/Frame 011471/0490
Assignment of Assignor's Interest
Recorded: 2001-01-25
Pages: 4
Assignor
FARADAY TECHNOLOGY, INC.
Executed: 2000-12-27
Assignee
FARADAY TECHNOLOGY MARKETING GROUP, LLC
1841 LAUREL CREEK DRIVE, TROY, OHIO, 45373
Covered Property
(1)
Electrodeposition of Metals in Small Recesses for Manufacture of High Density Interconnects Using Reverse Puls Plating
Patent:
6,210,555 →
Application:
09/239,811 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 6, 1999
From: TAYLOR, E. JENNINGS; SUN, JENNY J.; ZHOU, CHENGDONG
To: FARADAY TECHNOLOGY, INC
Reel/Frame 009871/0290 →
Assignment of Assignor's Interest
May 29, 2008
From: FARADAY TECHNOLOGY MARKETING GROUP, LLC
To: FARADAY TECHNOLOGY, INC.
Reel/Frame 021006/0905 →
Assignment of Assignor's Interest
May 30, 2008
From: FARADAY TECHNOLOGY MARKETING GROUP, LLC
To: FARADAY TECHNOLOGY, INC.
Reel/Frame 021021/0177 →
Assignment of Assignor's Interest
Oct 7, 2009
From: FARADAY TECHNOLOGY, INC
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023337/0688 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →