Patent Assignment
Reel/Frame 009967/0440
Assignment of Assignor's Interest
Recorded: 1999-03-11
Pages: 3
Assignors
BEAMAN, BRIAN S.
Executed: 1999-02-16
FOGEL, KEITH E.
Executed: 1999-03-03
LAURO, PAUL A.
Executed: 1999-03-03
SHIH, DA-YUAN
Executed: 1999-03-01
Assignee
IBM CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Wafer Scale High Density Probe Assembly, Apparatus for Use Thereof and Methods of Fabrication Thereof
Patent:
7,282,945 →
Application:
09/254,769 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →