Patent Assignment
Reel/Frame 010089/0308
Assignment of Assignor's Interest
Recorded: 1999-07-14
Pages: 2
Assignors
SCHOENSTEIN, PAUL G.
Executed: 1999-05-23
SITLER, BENJAMIN L.
Executed: 1999-07-06
REAMEY, ROBERT H.
Executed: 1999-06-25
VOGDES, CHRISTINE E.
Executed: 1999-06-21
Assignee
RAYCHEM CORPORATION
300 CONSTITUTION DRIVE, MENLO PARK, CALIFORNIA, 94025
Covered Property
(1)
Dissipation of Heat from a Circuit Board Having Bare Silicon Chips Mounted Thereon
Patent:
6,162,663 →
Application:
09/295,081 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger & Reorganization
Apr 5, 2000
From: RAYCHEM CORPORATION, A CORPORATION OF DELAWARE
To: TYCO INTERNATIONAL (PA), INC., A CORPORATION OF NEVADA; TYCO INTERNATIONAL LTD., A CORPORATION OF BERMUDA; AMP INCORPORATED, A CORPORATION OF PENNSYLVANIA
Reel/Frame 011682/0001 →
Change of Name
Apr 5, 2001
From: AMP INCORPORATED, A CORPORATION OF PENNSYLVANIA
To: TYCO ELECTRONICS CORPORATION, A CORPORATION OF PENNSYLVANIA
Reel/Frame 011675/0436 →
Assignment of Assignor's Interest
May 1, 2003
From: TYCO ELECTRONICS CORPORATION
To: DOW CORNING CORPORATION
Reel/Frame 014007/0661 →