Patent Assignment
Reel/Frame 014007/0661
Assignment of Assignor's Interest
Recorded: 2003-05-01
Pages: 21
Assignor
TYCO ELECTRONICS CORPORATION
Executed: 2003-02-27
Assignee
DOW CORNING CORPORATION
2200 WEST SALZBURG ROAD P.O. BOX 994, INTELLECTUAL PROPERTY DEPT. MAIL CODE CO1232, MIDLAND, MICHIGAN, 48686-0994
Covered Properties
(25)
Sealing Member
Patent:
4,662,692 →
Application:
06/730,403 →
Organopolysiloxane Materials Having Decreased Surface Tack
Patent:
4,595,635 →
Application:
06/730,692 →
Method of Picking Up and Placing Gel Material
Patent:
4,750,962 →
Application:
07/001,121 →
Thermally Conductive Gel Materials
Patent:
4,852,646 →
Application:
07/063,552 →
Shielding and Sealing Gaskets
Patent:
4,900,877 →
Application:
07/218,417 →
Environmental Sealing
Patent:
5,229,058 →
Application:
07/663,776 →
Environmental Sealing
Patent:
5,286,516 →
Application:
07/666,552 →
Sealing Member and Methods of Sealing
Patent:
5,588,856 →
Application:
07/762,533 →
Environmentally Protected Connection
Patent:
5,226,837 →
Application:
07/968,243 →
Flame Retarded Gel Compositions
Patent:
5,441,560 →
Application:
08/157,018 →
Environmental Sealing
Patent:
5,418,001 →
Application:
08/195,727 →
Sealing Member
Patent:
5,529,508 →
Application:
08/221,728 →
Article for Splicing Electrical Wires
Patent:
5,520,974 →
Application:
08/408,433 →
Environmental Sealing
Patent:
5,601,668 →
Application:
08/448,007 →
Highly Thermally Conductive Yet Highly Comformable Alumina Filled Composition and Method of Making the Same
Patent:
5,929,138 →
Application:
08/746,024 →
Extruded Silicone Gel Profiles
Patent:
5,665,809 →
Application:
08/749,601 →
Sealing Member
Patent:
5,934,922 →
Application:
08/798,401 →
Silicone Sealing Material Exhibiting High Stress Relaxation
Patent:
5,886,111 →
Application:
08/809,519 →
Sealing Device and Method of Sealing
Patent:
6,123,336 →
Application:
08/863,764 →
Highly Thermally Conductive Yet Highly Conformable Alumina Filled Composition and Method of Making the Same
Patent:
6,031,025 →
Application:
09/256,809 →
Dissipation of Heat from a Circuit Board Having Bare Silicon Chips Mounted Thereon
Patent:
6,162,663 →
Application:
09/295,081 →
Gel Sealant Enclosure with Visual Seal Indication
Patent:
6,494,464 →
Application:
09/556,170 →
Dissipation of Heat from a Circuit Board Having Bare Silicon Chips Mounted Thereon
Patent:
6,531,771 →
Application:
09/890,602 →
Curable Silicone Gum Thermal Interface Material
Application:
10/213,673 →
Publication:
US 2003/0171487
Curable silicone gum based thermal interface material
Application:
60/363,666 →
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
May 20, 1985
From: UKEN, WILLIAM D.; DUBROW, ROBERT S.
To: RAYCHEM CORPORATION A CORP OF CA
Reel/Frame 004416/0446 →
Assignment of Assignors Interest.
May 20, 1985
From: DUBROW, ROBERT S.; DITTMER, CATHERINE A.; UKEN, WILLIAM D.
To: RAYCHEM CORPORATION, A CORP. OF CA.
Reel/Frame 004414/0966 →
Merger 4/14/87, Delaware
Mar 20, 1989
From: RAYCHEM CORPORATION, A CORP. OF CA (MERGED INTO); MEHCYAR CORPORATION, A DE CORP. (CHANGED TO)
To: RAYCHEM CORPORATION, A CORP. OF CA
Reel/Frame 005175/0324 →
Assignment of Assignors Interest.
Jan 17, 1992
From: COLLINS, MARY A.; PERKINS, DAVID G.; WHITE, HARRY E.
To: RAYCHEM CORPORATION A CORP. OF DELAWARE
Reel/Frame 005971/0501 →
Assignment of Assignor's Interest
Dec 1, 1993
From: CHIOTIS, ACHILLES; CORNELIUS, RAJENDRA S.; SONI, PRAVIN L.
To: RAYCHEM CORPORATION
Reel/Frame 006951/0656 →
Assignment of Assignor's Interest
Apr 1, 1994
From: CHIOTIS, ACHILLES; PERKINS, DAVE; BLUM, JOHN M.
To: RAYCHEM CORPORATION
Reel/Frame 006941/0908 →
Assignment of Assignor's Interest
Nov 5, 1996
From: MERCER, FRANK W.; CHING, DAVID P.; CICHOCKI, ZBIGNIEW; REAMEY, ROBERT H.
To: RAYCHEM CORPORATION
Reel/Frame 008248/0215 →
Assignment of Assignor's Interest
Mar 24, 1997
From: CHIOTIS, ACHILLES; WOJTOWICZ, JANUSZ
To: RAYCHEM CORPORATION
Reel/Frame 008498/0739 →
Assignment of Assignor's Interest
May 27, 1997
From: WOJTOWICZ, JANUSZ B.
To: RAYCHEM CORPORATION
Reel/Frame 008580/0949 →
Assignment of Assignor's Interest
Jul 28, 1997
From: CHIOTIS, ACHILLES
To: RAYCHEM CORPORATION
Reel/Frame 008627/0649 →
Assignment of Assignor's Interest
Jul 14, 1999
From: SCHOENSTEIN, PAUL G.; SITLER, BENJAMIN L.; REAMEY, ROBERT H.; VOGDES, CHRISTINE E.
To: RAYCHEM CORPORATION
Reel/Frame 010089/0308 →
Merger & Reorganization
Apr 5, 2000
From: RAYCHEM CORPORATION, A CORPORATION OF DELAWARE
To: TYCO INTERNATIONAL (PA), INC., A CORPORATION OF NEVADA; TYCO INTERNATIONAL LTD., A CORPORATION OF BERMUDA; AMP INCORPORATED, A CORPORATION OF PENNSYLVANIA
Reel/Frame 011682/0001 →
Assignment of Assignor's Interest
Sep 11, 2000
From: CHANDLER, DANIEL A; CURRY, DAVID W.
To: TYCO ELECTRONICS CORPORATION; AQUA-SEAL INTERNATIONAL LIMITED
Reel/Frame 011148/0847 →
Change of Name
Apr 5, 2001
From: AMP INCORPORATED, A CORPORATION OF PENNSYLVANIA
To: TYCO ELECTRONICS CORPORATION, A CORPORATION OF PENNSYLVANIA
Reel/Frame 011675/0436 →
Assignment of Assignor's Interest
Jan 11, 2002
From: SCHOENSTEIN, PAUL G.; SITLER, BENJAMIN L.; REAMEY, ROBERT H.; VOGDES, CHRISTINE E.
To: TYCO ELECTRONICS CORPORATION
Reel/Frame 012465/0606 →
Assignment of Assignor's Interest
Aug 6, 2002
From: ELLSWORTH, MARK W.; MORALES, MIGUEL A.; LLOYD, RICHARD B.
To: TYCO ELECTRONICS CORPORATION
Reel/Frame 013232/0199 →
Assignment of Assignor's Interest
Jul 19, 2005
From: DOW CORNING CORPORATION
To: TYCO ELECTRONICS CORPORATION
Reel/Frame 016274/0994 →
Change of Name
Feb 27, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045460/0278 →