DISSIPATION OF HEAT FROM A CIRCUIT BOARD HAVING BARE SILICON CHIPS MOUNTED THEREON

Inventors: Paul G. Schoenstein, Benjamin L. Sitler, Robert H. Reamey, Christine E. Vogdes

Patented Case View Patent ↗

⬇ PDF		Code	Description	Pages	PDF
	2001-11-06	`ABST`	Abstract	1	View
	2001-11-06	`LET.`	Miscellaneous Incoming Letter	38	View

Inventors

Paul G. Schoenstein Redwood City, CA

Benjamin L. Sitler Los Altos, CA

Robert H. Reamey Palo Alto, CA

Christine E. Vogdes Sunnyvale, CA

Attorneys & Agents of Record

SHERI NOVACK Reg. 32526 Attorney

MARGUERITE GERSTNER Reg. 32695 Attorney · TE CONNECTIVITY CORPORATION

MICHAEL ARONOFF Reg. 37770 Attorney · STANLEY BLACK & DECKER, INC.

Classification

USPC 257/720

H10W40/10 H10W72/877 H10W40/251 H10W90/00 H10W90/724 H10W90/736

Prosecution

Foreign Priority

09295081 · 1999-04-20 · UNITED STATES OF AMERICA

Patent Term Adjustment

0days

DOW SILICONES CORPORATION

from DOW CORNING CORPORATION

CHANGE OF NAME Recorded 2018-02-27

DOW CORNING CORPORATION

from TYCO ELECTRONICS CORPORATION

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded 2003-05-01

TYCO ELECTRONICS CORPORATION

from SITLER, BENJAMIN L., REAMEY, ROBERT H., VOGDES, CHRISTINE E., SCHOENSTEIN, PAUL G.

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded 2002-01-11

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