Patent Assignment
Reel/Frame 010145/0175
Assignment of Assignor's Interest
Recorded: 1999-07-28
Pages: 2
Assignor
SUGAI, KAZUMI
Executed: 1999-07-19
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing a Semiconductor Device with Trenches Including Forming a Copper Thin Film Reflowing
Patent:
6,569,756 →
Application:
09/361,984 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 14, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013575/0301 →
Assignment of Assignor's Interest
May 28, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013687/0458 →
Change of Name
Oct 25, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025185/0906 →