Patent Assignment
Reel/Frame 013575/0301
Assignment of Assignor's Interest
Recorded: 2003-04-14
Pages: 10
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property
(1)
Method for Manufacturing a Semiconductor Device with Trenches Including Forming a Copper Thin Film Reflowing
Patent:
6,569,756 →
Application:
09/361,984 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 28, 1999
From: SUGAI, KAZUMI
To: NEC CORPORATION
Reel/Frame 010145/0175 →
Assignment of Assignor's Interest
May 28, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013687/0458 →
Change of Name
Oct 25, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025185/0906 →